Title: 

Development of 3-D RF microsystems using additive manufacturing technology

Committee:

Dr. John Papapolymerou, ECE, Advisor

Dr. Andrew Peterson, ECE

Dr. John Cressler, ECE

Dr. Chuck Zhang, ISyE

Dr. Christos Alexopoulos, ISyE

Abstract:  

This work intends to explore advanced 3-D integrations for state-of-the-art components in wireless systems using various 3-D printing technologies. Several packaging techniques are discussed that utilize the inherent benefits of the 3-D printing techniques and the compatible materials of the 3-D printing system are assessed for their large processing format and compatibility with the build-up process. Based on these, structures with single layer and multilayer are investigated at RF and millimeter-wave (mm-wave) to explore the benefits of each 3-D printing technologies in terms of convenience, reliability, cost, and performance. For the first time，the operation frequency fabricated by 3-D printing is up to D-band. And a novel vertical via interconnect is applied to the integration of state-of-the-art (System on Package) SoP. Furthermore, the surface roughness effect was found to be related to the performance and analyzed in details for future work. This work significantly expands range of the applications on both active and passive RF components by 3-D printing technologies.