Title:  Reliability Studies of Ultra-small Copper-plated Through-package-vias in Ultra-thin Glass Interposers

Committee: 

Dr. Tummala, , Advisor 

Dr. Degertekin, Chair

Dr. Brand

Dr. Pucha

Abstract: The objective of the proposed research is to model and design copper-plated through package vias, leading to fabrication of test vehicles for characterization of defects, and validation of models by demonstration of reliability through accelerated lifetime testing.  The need for higher and higher bandwidth will continue to scale-down the TPV pitch. In addition, glass thicknesses and via-hole diameters can be reduced to improve I/O density and shorter interconnect length, further aggravating the reliability concerns. Additionally, the probability of failure of a package increases as the number of TPVs increase. Therefore, a comprehensive approach starting from TPV modeling, design, leading to process development and fabrication is required to realize reliable TPV structures. This forms the key focus of this thesis.