Abstract: This presentation will provide a retrospect and prospects for electronics interconnects, system integration, and packaging.

Biography: Muhannad S. Bakir received his B.E.E. degree (Summa Cum Laude) from Auburn University, Auburn, AL, in 1999 and his M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology in 2000 and 2003, respectively.

Bakir is currently an Associate Professor and the ON Semiconductor Junior Professor in the School of Electrical and Computer Engineering at Georgia Tech. His areas of interest include three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, heterogeneous system interconnection, biosensors and their integration with CMOS circuitry, and nanofabrication technology. Bakir is the editor of a book entitled Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Artech House, 2009; with James D. Meindl) and is the author/coauthor of more than 110 journal publications and conference proceedings, 6 book chapters, 14 US patents, multiple invited presentations, and the presenter of 2 conference tutorials, including an invited tutorial on 3D technology at the 2007 International Solid-State Circuits Conference (ISSCC).

Professor Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award; 2012 DARPA Young Faculty Award; 2011 IEEE CPMT Society Outstanding Young Engineer Award; and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. Bakir and his research group have received fourteen conference and student paper awards, including five awards from the IEEE Electronic Components and Technology Conference (ECTC), four awards from the IEEE International Interconnect Technology Conference (IITC), and one award from the IEEE Custom Integrated Circuits Conference (CICC).