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Figure 4. All-Cu die-attach joints formed after densification of patterned nano-Cu foam films

Figure 4. All-Cu die-attach joints formed after densification of patterned nano-Cu foam films

Details

Resolution: 300 x 964

Created By: cheath6 - 05/18/2018 14:34 PM

Modified: 05/18/2018 14:34 PM

File Size: 95.39kB