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Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.

Advanced high-temperature epoxy molding compound structure for improved thermal stability, thermal dissipation, fracture toughness and mechanical reliability, at Georgia Tech.

Details

Resolution: 952 x 2059

Created By: Karen May - 11/21/2016 09:23 AM

Modified: 11/21/2016 09:24 AM

File Size: 216.89kB