image

First 2.5D glass interposer prototype fabricated using low-cost processes and panel-level chip assembly at 50 micron thick bump pitch.

First 2.5D glass interposer prototype fabricated using low-cost processes and panel-level chip assembly at 50 micron thick bump pitch.

Details

Resolution: 412 x 550

Created By: Karen May - 01/25/2016 15:00 PM

Modified: 10/07/2016 22:53 PM

File Size: 67.47kB