{"691802":{"#nid":"691802","#data":{"type":"event","title":"PhD Proposal by Rebecca Kate Banner ","body":[{"value":"\u003Cp\u003ERebecca Kate Banner\u0026nbsp;\u003Cbr\u003EAdvisor: Dr. Michael Filler Dr. Eric Vogel\u003C\/p\u003E\u003Cp\u003E\u003Cbr\u003E\u003Cem\u003Ewill propose a doctoral thesis entitled\u003C\/em\u003E,\u003C\/p\u003E\u003Cp\u003E\u003Cbr\u003E\u003Cstrong\u003EFluidic Release and Adaptive Interconnection for Distributed Micromodular Manufacturing\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cbr\u003E\u003Cem\u003EOn\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cbr\u003EThursday, August 27 at 11 am.\u003Cbr\u003ELove Building Room 210\u003C\/p\u003E\u003Cp\u003Eand\/or\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;Virtually via MS Teams\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EJoin:\u0026nbsp;\u003C\/strong\u003E\u003Ca href=\u0022https:\/\/teams.microsoft.com\/meet\/2544541598578?p=fO1Hkfy2luTTnpDsv7\u0022\u003Ehttps:\/\/teams.microsoft.com\/meet\/2544541598578?p=fO1Hkfy2luTTnpDsv7\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EMeeting ID: 254 454 159 857 8\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003EPasscode: BX26Mq2n\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECommittee\u003C\/strong\u003E\u003Cbr\u003EDr. Michael Filler- School of Chemical and Biomolecular Engineering (Advisor)\u003C\/p\u003E\u003Cp\u003EDr. Eric Vogel - School of Materials Science and Engineering (Co-advisor)\u003C\/p\u003E\u003Cp\u003EDr. Victor Breedveld - School of Chemical and Biomolecular Engineering\u003C\/p\u003E\u003Cp\u003EDr. Anju Toor - School of Materials Science and Engineering\u003C\/p\u003E\u003Cp\u003EDr. Juan-Pablo Correa-Baen - School of Materials Science and Engineering\u003C\/p\u003E\u003Cp\u003E\u003Cbr\u003E\u003Cstrong\u003EAbstract\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EThe semiconductor industry has achieved extraordinary control over device performance at the wafer scale, but no existing route reconciles that performance with the substrate flexibility, accessibility, speed, and heterogeneous integration needed for on-demand fabrication of application-specific microelectronics. Fluidic release and adaptive interconnection enable microchiplets, individually fabricated semiconductor devices, to be released into suspension, deposited stochastically, identified by computer vision, and interconnected according to their realized position. However, widespread implementation is limited by challenges in substrate-dependent electrical performance, microchiplet misalignment, scalable release, and control over microchiplet design across the integrated process. Addressing these challenges requires a comprehensive approach spanning substrate compatibility, adaptive interconnection, scalable release and transport, and integrated process design, pursued through four research aims. The first determines which interfacial properties govern adhesion after transfer, establishing design rules for microchiplet transfer across substrate classes. The second addresses microchiplet misalignment through automated, computer-vision-based detection and adaptive routing that wires microchiplets into functional circuits. The third establishes scalable microchiplet release and transport, identifying process conditions that balance release completeness against mechanical integrity. The fourth applies design-space variation across microchiplet size, shape, and process conditions, controlling release, placement, and orientation within the now-integrated flow. By integrating substrate characterization, adaptive interconnection, scalable release, and integrated process design, this work establishes a systematic framework for distributed, fluidic microelectronic manufacturing. The outcomes will provide practical design rules for microchiplet transfer, release, and deposition, enabling scalable, application-matched heterogeneous electronics.\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003E\u003Cstrong\u003EFluidic Release and Adaptive Interconnection for Distributed Micromodular Manufacturing\u003C\/strong\u003E\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Fluidic Release and Adaptive Interconnection for Distributed Micromodular Manufacturing"}],"uid":"27707","created_gmt":"2026-08-19 14:43:52","changed_gmt":"2026-08-19 14:45:20","author":"Tatianna Richardson","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2026-08-27T11:00:00-04:00","event_time_end":"2026-08-27T13:00:00-04:00","event_time_end_last":"2026-08-27T13:00:00-04:00","gmt_time_start":"2026-08-27 15:00:00","gmt_time_end":"2026-08-27 17:00:00","gmt_time_end_last":"2026-08-27 17:00:00","rrule":null,"timezone":"America\/New_York"},"location":"Love Building Room 210 and\/or  Virtually via MS Teams","extras":[],"groups":[{"id":"221981","name":"Graduate Studies"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}