{"690157":{"#nid":"690157","#data":{"type":"event","title":"Workshop | XTPL live demo ","body":[{"value":"\u003Cdiv\u003E\u003Cdiv\u003E\u003Cdiv\u003E\u003Cp\u003ENext-generation semiconductor chiplet packaging is increasingly dependent on ultra-fine interposer interconnects to achieve the bandwidth, power efficiency, and integration density required for next generation devices as chiplets replace monolithic die designs, the need for extremely dense signal routing between dies becomes critical, particularly on glass and silicon interposers where connections must be made within a very small footprint.\u003C\/p\u003E\u003Cp\u003EXTPL\u2019s Ultra-Precise Dispensing (UPD) technology offers a low-cost additive alternative to traditional lithography for creating these sub 5-micron interconnects. By directly depositing highly conductive materials with micron and sub-micron precision, XTPL enables fine line formation without the complexity, waste, and capital expense associated with subtractive photolithographic processing with excellent uniformity and yield.\u003C\/p\u003E\u003Cdiv\u003E\u003Cdiv\u003E\u003Cdiv\u003E\u003Cp\u003E\u003Cstrong\u003EPresenters:\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EUrs Berger\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EManaging Director XTPL Inc.\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003EKyle Homan\u003C\/p\u003E\u003Cp\u003E\u003Cbr\u003EField Applications Engineer XTPL Inc.\u003C\/p\u003E\u003C\/div\u003E\u003C\/div\u003E\u003C\/div\u003E\u003C\/div\u003E\u003C\/div\u003E\u003C\/div\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EJoin us for a presentation and live demo on using additive manufacturing for sub 5-micron interconnects for semiconductor chiplet packaging applications.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Featuring Urs Berger and Kyle Homan, representatives from XTPL inc."}],"uid":"36620","created_gmt":"2026-05-05 20:19:23","changed_gmt":"2026-05-06 15:19:07","author":"rgrieco6","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2026-05-12T11:45:00-04:00","event_time_end":"2026-05-12T13:00:00-04:00","event_time_end_last":"2026-05-12T13:00:00-04:00","gmt_time_start":"2026-05-12 15:45:00","gmt_time_end":"2026-05-12 17:00:00","gmt_time_end_last":"2026-05-12 17:00:00","rrule":null,"timezone":"America\/New_York"},"location":"Marcus Nanotechnology Building 1117-1118","extras":["free_food"],"related_links":[{"url":"https:\/\/gatech.co1.qualtrics.com\/jfe\/form\/SV_aYpo27wkstPXdI2","title":"Register here"}],"groups":[{"id":"660369","name":"Matter and Systems"}],"categories":[],"keywords":[{"id":"189814","name":"go-researchevents"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"194682","name":"Workshop"}],"invited_audience":[{"id":"194945","name":"Alumni"},{"id":"78761","name":"Faculty\/Staff"},{"id":"177814","name":"Postdoc"},{"id":"78771","name":"Public"},{"id":"174045","name":"Graduate students"},{"id":"78751","name":"Undergraduate students"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003E\u003Ca href=\u0022mailto:nik.roeske@gatech.edu\u0022\u003ENik Roeske\u003C\/a\u003E\u003C\/p\u003E","format":"limited_html"}],"email":[],"slides":[],"orientation":[],"userdata":""}}}