{"689490":{"#nid":"689490","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Shane Oh","body":[{"value":"\u003Cdiv\u003E\u003Cstrong\u003ETitle: \u003C\/strong\u003E3D Heterogeneous Integration for RF\/mmWave Electronics\u003C\/div\u003E\u003Cdiv\u003E\u003Cbr\u003E\u003Cstrong\u003EThesis committee:\u003C\/strong\u003E\u003C\/div\u003E\u003Cul\u003E\u003Cli\u003E\u003Cdiv\u003EDr. Muhannad S. Bakir (advisor)\u003C\/div\u003E\u003C\/li\u003E\u003Cli\u003E\u003Cdiv\u003EDr. Azadeh Ansari\u003C\/div\u003E\u003C\/li\u003E\u003Cli\u003E\u003Cdiv\u003EDr. John D. Cressler\u003C\/div\u003E\u003C\/li\u003E\u003Cli\u003E\u003Cdiv\u003EDr. Jane Gu\u003C\/div\u003E\u003C\/li\u003E\u003Cli\u003E\u003Cdiv\u003EDr. Suresh Sitaraman\u003C\/div\u003E\u003C\/li\u003E\u003C\/ul\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003ERF\/mmWave systems require 3D packaging solutions that maintain signal integrity while enabling heterogeneous integration, yet conventional implementations remain constrained by lossy off-chip interconnects and package-bound architectures. This thesis investigates whether interconnects can be engineered as independent building blocks for heterogeneous RF\/mmWave systems. It presents a 3D stitch-chip-based, interconnect-focused integration platform that decouples interconnect design from active dice and enables independent optimization of electrical performance and integration flexibility. The concept is established through 3D stitch-chip fabrication and extended to active-die integration. Stacked-via and glass-via implementations further improve vertical scalability and broaden the architectural scope of stitch-chip-based integration. To address the isolation and loss limitations of conventional TSVs for RF\/mmWave vertical integration, airgap-isolated semi-coaxial TSV structures are developed to reduce parasitic effects and enable 50 \u03a9 design at reduced pitch. Finally, a liquid-cooled pin-fin platform incorporating airgap-isolated TSVs demonstrates the feasibility of extending the proposed interconnect approach toward thermally managed multi-tier RF\/mmWave integration.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"3D Heterogeneous Integration for RF\/mmWave Electronics"}],"uid":"36804","created_gmt":"2026-04-07 13:16:53","changed_gmt":"2026-04-07 13:31:33","author":"jjones779","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2026-04-13T13:00:00-04:00","event_time_end":"2026-04-13T15:00:00-04:00","event_time_end_last":"2026-04-13T15:00:00-04:00","gmt_time_start":"2026-04-13 17:00:00","gmt_time_end":"2026-04-13 19:00:00","gmt_time_end_last":"2026-04-13 19:00:00","rrule":null,"timezone":"America\/New_York"},"location":"Online","extras":[],"related_links":[{"url":"https:\/\/gatech.zoom.us\/s\/97479881077?pwd=c68ae31PADgaYXgXisFA4I7VtR4e01.1","title":"Zoom Link "}],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}