689120 event 1774188550 1774389258 <![CDATA[Ph.D. Proposal Oral Exam - Geyu Yan]]> Title:  Advanced Packaging and Cooling Platforms for 3D Heterogeneous Integration

Committee:

Dr. Bakir, Advisor

Dr. Ansari, Chair

Dr. Yu

]]> The objective of the proposed research is to develop advanced packaging and cooling platforms that enable scalable, high-performance 3D heterogeneous integration (HI). This work investigates a co-designed architecture in which high-aspect-ratio through-silicon vias (TSVs) are integrated directly within micropin-fin heat sinks (MPFHSs), providing both vertical electrical interconnects and efficient microfluidic cooling. Preliminary studies demonstrate TSV-compatible MPFHS structures through modeling, fabrication of HAR TSVs, and 3D thermal testbeds capable of dissipating heat fluxes exceeding 300 W/cm². To overcome TSV height limitations, a segmented TSV and micropin-fin approach is introduced, with numerical results showing improved TSV density, lower parasitics, and enhanced cooling efficacy. The proposed research will (1) model and experimentally validate segmented TSV and micropin-fin tiers, (2) demonstrate TSV-embedded microfluidic cooling for heterogeneous MMICs, (3) advance an extreme Bosch process for ultra-HAR TSVs, and (4) study cap-layer thickness effects on mechanical and electrical reliability of MPFHSs. Together, these efforts establish a scalable foundation for next-generation 3D HI systems.

]]> <![CDATA[]]> https://teams.microsoft.com/l/meetup-join/19%3ameeting_NTNlODkzZGMtMmRhZS00YjUyLWFlNDAtNjhmMjNkZTI1OGMz%40thread.v2/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%22f3269434-c53a-4081-b406-394bfb03507c%22%7d 434371 1788 102851 1808