{"689120":{"#nid":"689120","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Geyu Yan","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EAdvanced Packaging and Cooling Platforms for 3D Heterogeneous Integration\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EDr. Bakir, Advisor\u003C\/p\u003E\u003Cp\u003EDr. Ansari, Chair\u003C\/p\u003E\u003Cp\u003EDr. Yu\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe objective of the proposed research is to develop advanced packaging and cooling platforms that enable scalable, high-performance 3D heterogeneous integration (HI). This work investigates a co-designed architecture in which high-aspect-ratio through-silicon vias (TSVs) are integrated directly within micropin-fin heat sinks (MPFHSs), providing both vertical electrical interconnects and efficient microfluidic cooling. Preliminary studies demonstrate TSV-compatible MPFHS structures through modeling, fabrication of HAR TSVs, and 3D thermal testbeds capable of dissipating heat fluxes exceeding 300 W\/cm\u00b2. To overcome TSV height limitations, a segmented TSV and micropin-fin approach is introduced, with numerical results showing improved TSV density, lower parasitics, and enhanced cooling efficacy. The proposed research will (1) model and experimentally validate segmented TSV and micropin-fin tiers, (2) demonstrate TSV-embedded microfluidic cooling for heterogeneous MMICs, (3) advance an extreme Bosch process for ultra-HAR TSVs, and (4) study cap-layer thickness effects on mechanical and electrical reliability of MPFHSs. Together, these efforts establish a scalable foundation for next-generation 3D HI systems.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Advanced Packaging and Cooling Platforms for 3D Heterogeneous Integration"}],"uid":"28475","created_gmt":"2026-03-22 14:09:10","changed_gmt":"2026-03-24 21:54:18","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2026-04-02T14:30:00-04:00","event_time_end":"2026-04-02T16:30:00-04:00","event_time_end_last":"2026-04-02T16:30:00-04:00","gmt_time_start":"2026-04-02 18:30:00","gmt_time_end":"2026-04-02 20:30:00","gmt_time_end_last":"2026-04-02 20:30:00","rrule":null,"timezone":"America\/New_York"},"location":"Online","extras":[],"related_links":[{"url":"https:\/\/teams.microsoft.com\/l\/meetup-join\/19%3ameeting_NTNlODkzZGMtMmRhZS00YjUyLWFlNDAtNjhmMjNkZTI1OGMz%40thread.v2\/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%22f3269434-c53a-4081-b406-394bfb03507c%22%7d","title":"Microsoft Teams Meeting link"}],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}