{"688638":{"#nid":"688638","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Srujan Penta","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EDie-To-Die (D2D) Interfaces in Chiplet Systems enabled by Standard, Advanced, and Novel Packaging Technologies: A Case Study on the UCIe Interface\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EDr. Bakir, Advisor\u003C\/p\u003E\u003Cp\u003EDr. Sathe, Chair\u003C\/p\u003E\u003Cp\u003EDr. Yu\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe objective of the proposed research is to systematically investigate Die-to-Die (D2D) interfaces in chiplet-based systems across multiple packaging technologies, with a particular focus on the Universal Chiplet Interconnect Express (UCIe) standard. As heterogeneous integration becomes central to meeting the performance, bandwidth, and modularity demands of AI, HPC, and data-centric workloads, understanding how D2D signaling behavior varies across organic substrates, 2.5D interposers, 3D-ICE architectures, and emerging glass core substrates is critical. This research develops a unified modeling, simulation, and benchmarking framework that captures electrical performance on package- and system-level governing D2D performance. Preliminary work evaluates UCIe links in organic and 3D-ICE packages along with relative cost dynamics of UCIe-based chiplet-systems in 2D and 2.5D packaging technologies. The proposed work aims at extending these studies to glass substrates, perform design-space exploration across packaging technologies, assess via-region impacts, and include system-level architectural simulations. The final outcome aims to provide validated performance-cost tradeoffs, predictive machine-learning models, and design guidelines that enable standardized, high-performance, and scalable chiplet systems.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Die-To-Die (D2D) Interfaces in Chiplet Systems enabled by Standard, Advanced, and Novel Packaging Technologies: A Case Study on the UCIe Interface"}],"uid":"28475","created_gmt":"2026-03-02 22:34:31","changed_gmt":"2026-03-02 22:35:33","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2026-03-31T13:30:00-04:00","event_time_end":"2026-03-31T15:30:00-04:00","event_time_end_last":"2026-03-31T15:30:00-04:00","gmt_time_start":"2026-03-31 17:30:00","gmt_time_end":"2026-03-31 19:30:00","gmt_time_end_last":"2026-03-31 19:30:00","rrule":null,"timezone":"America\/New_York"},"location":"Room W218, Van Leer","extras":[],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}