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<![CDATA[Ph.D. Proposal Oral Exam - Joel Slaby]]>
Title: Integrated Photonics and Packaging for Harsh EnvironmentsCommittee:
Dr. Ralph, Advisor
Dr. Cressler, Chair
Dr. Bakir
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The objective of the proposed research is to (1) develop a robust and repeatable fiber attach process, and (2) qualify and design packaged PICs for harsh environments by preparing them for space flight. The fiber attach process includes identifying novel alignment strategies and optimizing critical process steps during the attach. Qualifying the packaged PICs requires environmental testing and designing mitigations for photonic devices against thermal testing, shock and vibration studies, and radiation exposure.]]>
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