{"686356":{"#nid":"686356","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Euichul Chung","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EElectrical and Thermal Co-design of Interconnects and Microfluidic Cooling Technologies for 2.5D\/3D Heterogeneous Integration\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EDr. Bakir, Advisor\u003C\/p\u003E\u003Cp\u003EDr. Naeemi, Chair\u003C\/p\u003E\u003Cp\u003EDr. Ansari\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe objective of the proposed research is the electro-thermal co-design of interconnects and microfluidic cooling technologies to address the challenges of 2.5D and 3D heterogeneous integration in high-performance and quantum computing applications. Two key enabling technologies for such integration are (1) high-density interconnects and (2) effective thermal management solutions, both becoming increasingly critical as system architectures grow in complexity. This study proposes co-designing interconnect and microfluidic cooling technologies to simultaneously meet performance and reliability requirements in advanced packaging platforms. First, we investigate (1) system-level thermal management strategy for a 2.5D high-bandwidth memory (HBM) - graphic processing units (GPUs) integrated with top-side single-phase microfluidic cooling solution, designed to mitigate the challenges associated with multi-die, multi-height configurations and the increasing power density of the dies. Furthermore, as top-side microfluidic cooling technologies approach their limits, we delve into (2) inter-tier microfluidic cooling design for 3D-ICs where TSVs are integrated within a micropin-fin heat sink to enable efficient heat dissipation across stacked dies while maintaining electrical interconnection. Furthermore, we analyze(3) 3D copper compressible microinterconnects (CMIs) as an off-chip interconnect for advanced packaging and explore their potential extension to quantum packaging applications. Building on this preliminary study, the research proposes (1) topology-optimized interlayer cooling with localized TSV architectures to achieve higher bandwidth density while minimizing system temperature, and (2) single- or bi-layer CMIs as off-chip interconnects for quantum computing applications, with a focus on thermal and superconducting CMI technologies.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Electrical and Thermal Co-design of Interconnects and Microfluidic Cooling Technologies for 2.5D\/3D Heterogeneous Integration"}],"uid":"28475","created_gmt":"2025-11-11 16:15:54","changed_gmt":"2025-11-12 12:49:11","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2025-11-20T15:30:00-05:00","event_time_end":"2025-11-20T17:30:00-05:00","event_time_end_last":"2025-11-20T17:30:00-05:00","gmt_time_start":"2025-11-20 20:30:00","gmt_time_end":"2025-11-20 22:30:00","gmt_time_end_last":"2025-11-20 22:30:00","rrule":null,"timezone":"America\/New_York"},"location":"Online","extras":[],"related_links":[{"url":"https:\/\/teams.microsoft.com\/l\/meetup-join\/19%3ameeting_M2RhZWY3YjQtMzg2MC00NjcwLTg3NDgtNmE2ZWQ3YWQ5Zjli%40thread.v2\/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%22c1ec1a51-8fba-4dc9-95c3-88245a28369a%22%7d","title":"Microsoft Teams Meeting link"}],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}