The position was established in the spring of 2025 to be awarded to a distinguished ECE faculty member who has demonstrated excellence in research and teaching in the areas of chiplet-based integrated circuit (IC) systems, 2.5D, and 3D IC technologies.
“I am grateful to GlobalFoundries for establishing this chair position in ECE, and honored to be the inaugural recipient,” Bakir said. “Advanced packaging and heterogeneous integration are a key differentiator and driver of innovation in virtually all leading-edge electronic systems from handheld devices to data centers powering AI. ECE’s partnership with GlobalFoundries will position the School for many unique research and educational programs development to support 2.5D and 3D technologies.”
3D heterogeneous integration (3DHI) is a cutting-edge technology that merges various ICs and components, including processors, memory, sensors, and RF modules, into one 3D package.
Bakir is currently the Dan Fielder Professor in ECE and the director of the 3D Systems Packaging Research Center supported by the Institute for Matter and Systems, where he oversees an interdisciplinary approach to electronic packaging research.
]]>The appointment recognizes Bakir’s leadership in advanced packaging and expands Georgia Tech’s role in the field.