{"682120":{"#nid":"682120","#data":{"type":"news","title":"Oh Wins IEEE Transactions on Components, Packaging and Manufacturing Technology Best Paper Award","body":[{"value":"\u003Cp\u003E\u003Ca href=\u0022https:\/\/ece.gatech.edu\/\u0022\u003EGeorgia Tech School of Electrical and Computer Engineering\u003C\/a\u003E (ECE) fifth-year Ph.D. candidate Shane Oh is receiving recognition for his research that has potential for huge impacts in advanced packaging technologies for high-frequency electronics.\u003C\/p\u003E\u003Cp\u003EHis paper, \u201c\u003Ca href=\u0022https:\/\/ieeexplore.ieee.org\/abstract\/document\/10769467\u0022\u003EHeterogeneous Integration Enabled by 3D Stitch-Chips,\u003C\/a\u003E\u0022 recently won the Best Paper Award in the Advanced Packaging Technologies from the IEEE \u003Ca href=\u0022https:\/\/ieeexplore.ieee.org\/xpl\/RecentIssue.jsp?punumber=5503870\u0022\u003ETransactions on Components, Packaging and Manufacturing Technology\u003C\/a\u003E, a premier package design publication.\u003C\/p\u003E\u003Cp\u003ETraditional chip interconnect methods like wire-bonding or flip-chip mounting either struggle with signal integrity at high frequencies or require complex fabrication steps.\u003C\/p\u003E\u003Cp\u003EThe paper introduces a new interconnect technology called the 3D Stitch-Chip (3DSC), which offers a novel solution to the limitations of traditional interconnection methods such as wire bonding, die-embedding, and flip-chip bonding. Existing methods can be bulky, hard to manufacture, or cause issues with signal quality, especially when dealing with fast, high-frequency signals used in modern electronics.\u003C\/p\u003E\u003Cp\u003E3DSC avoids these problems by using a special structure that includes vertical channels and lateral connectors to link chips together. This allows the chips to be mounted face-up, without digging cavities, and helps keep signals clear even at very high speeds. This new method was successfully demonstrated for Ka-band frequencies (26-40 gigahertz), which are used in cutting-edge wireless and radar systems. Its modular design makes it especially useful for building complex systems that combine many different chips in a compact space.\u003C\/p\u003E\u003Cp\u003EHe, along with his co-authors\u2014\u0026nbsp;Ph.D. students Zhonghao Zhang and Geyu Yan, and Georgia Tech Research Institute senior research engineer Paul K. Jo\u2014conducted the research under the guidance of professor \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/muhannad-s-bakir\u0022\u003EMuhannad S. Bakir\u003C\/a\u003E, as part of the\u003Ca href=\u0022https:\/\/www.bakirlab.gatech.edu\/\u0022\u003E Integrated 3D Systems Group\u003C\/a\u003E.\u003C\/p\u003E\u003Cp\u003EThe work contributes to the group\u2019s broader mission\u0026nbsp;to rethink packaging architectures for heterogeneous integration, enabling future radio frequency systems to be smaller, faster, and more efficient.\u003C\/p\u003E\u003Cp\u003EOh, Zhang, Jo, and Bakir will accept the award during the \u003Ca href=\u0022https:\/\/ectc.net\/\u0022\u003E75th Electronic Components and Technology Conference\u003C\/a\u003E.\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe research, which introduces a novel chip interconnect technology, is an important step toward more flexible multichip modules and advanced glass-based packaging platforms.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"The research, which introduces a novel chip interconnect technology, is an important step toward more flexible multichip modules and advanced glass-based packaging platforms."}],"uid":"36558","created_gmt":"2025-04-29 17:51:58","changed_gmt":"2025-04-29 17:56:23","author":"zwiniecki3","boilerplate_text":"","field_publication":"","field_article_url":"","location":"Atlanta, GA","dateline":{"date":"2025-04-29T00:00:00-04:00","iso_date":"2025-04-29T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"676993":{"id":"676993","type":"image","title":"Oh.jpg","body":null,"created":"1745949183","gmt_created":"2025-04-29 17:53:03","changed":"1745949183","gmt_changed":"2025-04-29 17:53:03","alt":"Shane Oh","file":{"fid":"260850","name":"Oh.jpg","image_path":"\/sites\/default\/files\/2025\/04\/29\/Oh.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/2025\/04\/29\/Oh.jpg","mime":"image\/jpeg","size":792518,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/2025\/04\/29\/Oh.jpg?itok=sh9QfmAM"}}},"media_ids":["676993"],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"145","name":"Engineering"}],"keywords":[{"id":"103141","name":"Best Paper Award"},{"id":"1187","name":"IEEE"},{"id":"194491","name":"Transactions on Components"},{"id":"194492","name":"Packaging and Manufacturing Technology"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EZachary Winiecki\u003C\/p\u003E","format":"limited_html"}],"email":["zwiniecki3@gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}