{"679741":{"#nid":"679741","#data":{"type":"news","title":"Georgia Tech Joins $840M DoD Project to Develop and Manufacture Next-gen Semiconductor Microsystems","body":[{"value":"\u003Cp lang=\u0022EN-US\u0022\u003EGeorgia Institute of Technology is set to play a crucial role in a strategic effort funded by the Defense Advanced Research Project Agency (DARPA) to help bolster America\u2019s national security and global military leadership.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThe project, led by the Texas Institute for Electronics (TIE) at The University of Texas at Austin, represents a total investment of $1.4 billion. The $840 million award from DARPA, \u003Ca href=\u0022https:\/\/news.utexas.edu\/2024\/07\/18\/uts-texas-institute-for-electronics-awarded-840m-to-build-a-dod-microelectronics-manufacturing-center-advance-u-s-semiconductor-industry\/\u0022\u003Eannounced by TIE in 2024\u003C\/a\u003E, aims to develop the next generation of high-performing semiconductor microsystems for the Department of Defense (DoD).\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u201cWe are honored to collaborate with TIE and its broader team on this far reaching and strategic program to enable best in class 3D heterogeneous integration (3DHI) processes and technologies in the United States,\u201d said \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/muhannad-s-bakir\u0022\u003EMuhannad S. Bakir\u003C\/a\u003E, the Dan Fielder Professor in the \u003Ca href=\u0022https:\/\/ece.gatech.edu\/\u0022\u003ESchool of Electrical and Computer Engineering\u003C\/a\u003E and director of the \u003Ca href=\u0022https:\/\/sites.gatech.edu\/ien-prc\/\u0022\u003E3D Systems Packaging Research Center\u003C\/a\u003E, who is heading the project for Georgia Tech.\u0026nbsp;\u003C\/p\u003E\u003Cp lang=\u0022EN-US\u0022\u003E3DHI is a semiconductor manufacturing process that incorporates different materials and components into microsystems with precision assembly. The use of 3DHI allows for the creation of high-performance, compact, and energy-efficient systems.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EThe investment is part of DARPA\u2019s Next Generation Microelectronics Manufacturing (NGMM) Program comprised of 32 defense electronics and leading commercial semiconductor companies and 18 nationally recognized academic institutions.\u003C\/p\u003E\u003Cp lang=\u0022EN-US\u0022\u003EUnder the agreement, TIE will establish a national open access R\u0026amp;D and prototyping fabrication facility. The facility will enable the DoD to create higher performance, lower power, lightweight, and compact defense systems. The advancements are expected to have wide-ranging applications, including radar, satellite imaging, and unmanned aerial vehicles.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EGeorgia Tech will provide a wide range of expertise in 3DHI including design, fabrication and assembly processes, and characterization to support the NGMM national open-access R\u0026amp;D and prototyping facility at TIE. \u0026nbsp;\u003C\/p\u003E\u003Cp lang=\u0022EN-US\u0022\u003ERegents\u0027 Professor and Morris M. Bryan, Jr. Professor \u003Ca href=\u0022https:\/\/me.gatech.edu\/faculty\/sitaraman\u0022\u003ESuresh K. Sitaraman\u003C\/a\u003E in the \u003Ca href=\u0022https:\/\/me.gatech.edu\/\u0022\u003EGeorge W. Woodruff School of Mechanical Engineering\u003C\/a\u003E will be a key contributor to Georgia Tech\u2019s efforts on the project.\u003C\/p\u003E\u003Cp\u003E\u201cWe are delighted to be partnering with UT\/TIE on the establishment of a 3D Heterogeneous Integration Microsystem prototyping \u0026nbsp;facility,\u201d said Sitaraman. \u201cIn addition to advancing fundamental science, this project is a great opportunity for Georgia Tech to demonstrate and integrate our ground-breaking and innovative 3DHI research approaches and technology solutions into TIE\u2019s prototyping facility, and understand the challenges involved when translating lab-scale research work to a large industry-strength fabrication facility.\u201d\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EECE Professors \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/saibal-mukhopadhyay\u0022\u003ESaibal Mukhopadhyay\u003C\/a\u003E, \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/arijit-raychowdhury\u0022\u003EArijit Raychowdhury\u003C\/a\u003E, \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/visvesh-s-sathe\u0022\u003EVisvesh Sathe\u003C\/a\u003E, and \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/shimeng-yu\u0022\u003EShimeng Yu\u003C\/a\u003E\u0026nbsp;will be working alongside Bakir and Sitaraman.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EA significant portion of the research will be conducted at the \u003Ca href=\u0022https:\/\/matter-systems.gatech.edu\/\u0022\u003EInstitute for Matter and Systems\u003C\/a\u003E (IMS), which operates Georgia Tech\u2019s state-of-the-art electronics and nanotechnology core facilities.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003ERead the \u003Ca href=\u0022https:\/\/www.txie.org\/tifea\/\u0022\u003Epress release\u003C\/a\u003E from TIE and view the \u003Ca href=\u0022https:\/\/www.txie.org\/tifea\/#partners\u0022\u003Eproject\u2019s team and partners\u003C\/a\u003E.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EResearchers will contribute extensive 3D heterogeneous integration expertise to the Texas Institute for Electronics-led initiative.\u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Researchers will contribute extensive 3D heterogeneous integration expertise to the Texas Institute for Electronics-led initiative. "}],"uid":"36172","created_gmt":"2025-01-21 14:58:25","changed_gmt":"2025-01-21 15:00:38","author":"dwatson71","boilerplate_text":"","field_publication":"","field_article_url":"","location":"Atlanta, GA","dateline":{"date":"2025-01-21T00:00:00-05:00","iso_date":"2025-01-21T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"676070":{"id":"676070","type":"image","title":"Marcus Nanotechnology Building","body":null,"created":"1737471519","gmt_created":"2025-01-21 14:58:39","changed":"1737471519","gmt_changed":"2025-01-21 14:58:39","alt":"Photo of the Marcus Nanotechnology Building. A glass building with sunshine shining through in the top right corner. ","file":{"fid":"259780","name":"14C10042-P1-118.jpg","image_path":"\/sites\/default\/files\/2025\/01\/21\/14C10042-P1-118.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/2025\/01\/21\/14C10042-P1-118.jpg","mime":"image\/jpeg","size":5052208,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/2025\/01\/21\/14C10042-P1-118.jpg?itok=A13avPiW"}}},"media_ids":["676070"],"groups":[{"id":"1188","name":"Research Horizons"}],"categories":[{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"135","name":"Research"}],"keywords":[{"id":"690","name":"darpa"},{"id":"543","name":"National Security"},{"id":"167686","name":"Semiconductors"},{"id":"194237","name":"3D Heterogeneous Integration"},{"id":"99661","name":"Muhannad S. Bakir"},{"id":"194238","name":"Suresh K. Sitaraman"},{"id":"194239","name":"Texas Institute for Electronics"},{"id":"166900","name":"Saibal Mukhopadhyay"},{"id":"139771","name":"Arijit Raychowdhury"},{"id":"191068","name":"Visvesh Sathe"},{"id":"178857","name":"Shimeng Yu"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"194240","name":"Three-Dimensional Systems Packaging Research Center"},{"id":"14545","name":"George W. Woodruff School of Mechanical Engineering"},{"id":"194241","name":"Institute for Matter and Systems"},{"id":"194242","name":"Next Generation Microelectronics Manufacturing"},{"id":"194243","name":"NGMM"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EDan Watson\u003C\/p\u003E","format":"limited_html"}],"email":["dwatson@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}