{"678848":{"#nid":"678848","#data":{"type":"news","title":"$100M Investment Will Propel Absolics Inc., Georgia Tech\u2019s Advanced Packaging Research ","body":[{"value":"\u003Cdiv\u003E\u003Cp\u003EAs part of the CHIPS \u003Ca href=\u0022https:\/\/www.nist.gov\/chips\/research-development-programs\/national-advanced-packaging-manufacturing-program\u0022 rel=\u0022noreferrer noopener\u0022 target=\u0022_blank\u0022\u003ENational Advanced Packaging Manufacturing Program (NAPMP),\u003C\/a\u003E three advanced packaging research projects will receive investments of up to $100 million each. This work will accelerate the development of cutting-edge substrate and materials technologies essential to the semiconductor industry. \u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003ENAPMP was developed to support a robust U.S. ecosystem for advanced packaging, which is key to every electronic system. NAPMP will enable leading-edge research and development, domestic manufacturing facilities, and robust training and workforce development programs in advanced packaging. \u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003EIn partnership with Georgia Tech and the \u003Ca href=\u0022https:\/\/prc.gatech.edu\/\u0022 rel=\u0022noreferrer noopener\u0022 target=\u0022_blank\u0022\u003E3D Packaging Research Center\u003C\/a\u003E (PRC), \u003Ca href=\u0022https:\/\/www.absolicsinc.com\/\u0022\u003EAbsolics\u003C\/a\u003E will receive $100 million to develop revolutionary glass core substrate panel manufacturing.\u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp lang=\u0022EN-US\u0022\u003E\u201cThis landmark investment in Absolics is also a transformational investment in Georgia Tech,\u201d said \u003Ca href=\u0022https:\/\/research.gatech.edu\/people\/timothy-charles-lieuwen\u0022 rel=\u0022noreferrer noopener\u0022 target=\u0022_blank\u0022\u003ETim Lieuwen\u003C\/a\u003E, interim executive vice president for Research. \u201cIt will redefine the possibilities of our longstanding partnership by expanding Georgia Tech\u2019s expertise in electronic packaging, which is vital to the semiconductor supply chain. This federal funding uniquely positions us to merge cutting-edge research with industry, drive economic development in Georgia, and create a workforce ready to tackle tomorrow\u2019s manufacturing demands.\u201d\u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003EGeorgia Tech has a long history of pioneering packaging research. \u003Ca href=\u0022https:\/\/research.gatech.edu\/georgia-tech-packaging-research-center-collaboration-skc-leads-600-million-semiconductor\u0022 rel=\u0022noreferrer noopener\u0022 target=\u0022_blank\u0022\u003EThrough a previous collaboration with the PRC\u003C\/a\u003E, Absolics has already invested in the state of Georgia by building a glass core substrate panel manufacturing facility in Covington.\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003EGeorgia Tech\u2019s \u003Ca href=\u0022http:\/\/matter-systems.gatech.edu\/\u0022 rel=\u0022noreferrer noopener\u0022 target=\u0022_blank\u0022\u003EInstitute for Matter and Systems\u003C\/a\u003E (IMS), home to the PRC, houses specialized core facilities with the capabilities for semiconductor advanced packaging research and development.\u0026nbsp;\u003C\/p\u003E\u003Cp\u003E\u201cAwards like this reinforce the importance of collaborative research between research disciplines and the private and public sector. Without the research and administrative support provided by IMS and the Georgia Tech Office of Research Development, projects like this would not be coming to Georgia Tech.\u201d said \u003Ca href=\u0022https:\/\/matter-systems.gatech.edu\/people\/eric-vogel\u0022 rel=\u0022noreferrer noopener\u0022 target=\u0022_blank\u0022\u003EEric Vogel\u003C\/a\u003E, IMS executive director.\u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003E\u0026nbsp;Georgia Tech is a leader in advanced packaging research and has been working on glass substrate packaging research and development for years. Through this new Substrate and Materials Advanced Research and Technology (SMART) Packaging Program, Absolics aims to build a glass-core packaging ecosystem. In collaboration with Absolics, Georgia Tech will receive money for research and development for a glass-core substrate research center. \u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003E\u201cWe are delighted to partner with Absolics and the broader team on this new NAPMP program focused on glass-core packaging,\u201d said \u003Ca href=\u0022https:\/\/matter-systems.gatech.edu\/people\/muhannad-s-bakir\u0022 rel=\u0022noreferrer noopener\u0022 target=\u0022_blank\u0022\u003EMuhannad Bakir,\u003C\/a\u003E Dan Fielder Professor in the School of Electrical and Computer Engineering and PRC director. \u201cGeorgia Tech\u2019s role will span program leadership, research and development of novel glass-core packages, technology transition, and workforce development.\u201d Bakir will serve as the associate director of SMART Packaging Program, overseeing research and workforce development activities while also leading several research tasks. \u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp lang=\u0022EN-US\u0022\u003E\u0026nbsp;\u0022This project will advance large-area glass panel processing with innovative contributions to materials and processing, modeling and simulation, metrology and characterization, and testing and reliability. We are pleased to partner with Absolics in advancing these important technology areas,\u0022 said Regents\u0027 Professor \u003Ca href=\u0022https:\/\/matter-systems.gatech.edu\/people\/suresh-sitaraman\u0022\u003ESuresh K. Sitaraman\u003C\/a\u003E of the George W. Woodruff School of Mechanical Engineering and the PRC. In addition to technical contributions, Sitaraman will direct the new SMART Packaging Program steering committee. \u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003E\u0026nbsp;\u201cThe NAPMP Materials and Substrates R\u0026amp;D award for glass substrates marks the culmination of extensive efforts spearheaded by Georgia Tech\u2019s Packaging Research Center,\u201d noted \u003Ca href=\u0022https:\/\/people.research.gatech.edu\/node\/4186\u0022\u003EGeorge White\u003C\/a\u003E, senior director of strategic partnerships and the theme leader for education and workforce development in the SMART Packaging Program. \u201cThis recognition highlights the state of Georgia\u2019s leadership in advanced substrate technology and paves the way for developing the next generation of talent in glass-based packaging.\u201d \u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E\u003Cdiv\u003E\u003Cp\u003E\u0026nbsp;The program will support education and workforce development efforts by bringing training, internships, and certificate opportunities to technical colleges, the HBCU CHIPS Network, and veterans\u0027 programs.\u0026nbsp;\u003C\/p\u003E\u003C\/div\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe award will grow electronic packaging expertise and drive economic growth in Georgia.\u0026nbsp;\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"The award will grow electronic packaging expertise and drive economic growth in Georgia. "}],"uid":"35272","created_gmt":"2024-12-12 14:35:20","changed_gmt":"2024-12-20 15:16:04","author":"aneumeister3","boilerplate_text":"","field_publication":"","field_article_url":"","location":"Atlanta, GA","dateline":{"date":"2024-12-12T00:00:00-05:00","iso_date":"2024-12-12T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"675838":{"id":"675838","type":"image","title":"AdobeStock_335004214.jpeg","body":null,"created":"1734014227","gmt_created":"2024-12-12 14:37:07","changed":"1734014227","gmt_changed":"2024-12-12 14:37:07","alt":"Man holding computer chip","file":{"fid":"259509","name":"AdobeStock_335004214.jpeg","image_path":"\/sites\/default\/files\/2024\/12\/12\/AdobeStock_335004214.jpeg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/2024\/12\/12\/AdobeStock_335004214.jpeg","mime":"image\/jpeg","size":548899,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/2024\/12\/12\/AdobeStock_335004214.jpeg?itok=qFYAH_lG"}}},"media_ids":["675838"],"groups":[{"id":"660369","name":"Matter and Systems"}],"categories":[{"id":"149","name":"Nanotechnology and Nanoscience"}],"keywords":[{"id":"187915","name":"go-researchnews"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"193652","name":"Matter and Systems"}],"news_room_topics":[{"id":"71881","name":"Science and Technology"}],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003E\u003Ca href=\u0022mailto:amelia.neumeister@research.gatech.edu\u0022\u003EAmelia Neumeister\u003C\/a\u003E | Research Communications Program Manager\u003C\/p\u003E","format":"limited_html"}],"email":["amelia.neumeister@research.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}