{"678285":{"#nid":"678285","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Ashita Victor","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EWafer-scale Chiplet Reconstitution Technology for High-density Heterogeneous Integration\u003C\/em\u003E\u003C\/p\u003E\u003Cp\u003E\u003Cstrong\u003ECommittee:\u0026nbsp;\u003C\/strong\u003E\u003C\/p\u003E\u003Cp\u003EDr.\u0026nbsp;Bakir, Advisor\u0026nbsp;\u003C\/p\u003E\u003Cp\u003EDr. Ansari, Chair\u003C\/p\u003E\u003Cp\u003EDr. Mukhopadhyay\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe objective of the proposed research is to enable high-density heterogeneous integration (HI) of chiplets using wafer-scale packaging techniques. As the number of chiplets in a package increases, it becomes more challenging to achieve near-monolithic integration. To tackle this challenge, we propose a chiplet reconstitution technology that leverages low-temperature silicon dioxide (SiO2) to encapsulate an array of closely spaced chiplets to form a reconstituted tier. This approach allows for post-processing on the chiplets at a wafer scale. These chiplet tiers can potentially be stacked in 3D to enable high-density chiplet integration. We have developed fabrication testbeds to demonstrate this proposed packaging solution. The fabrication testbed comprises of a dense array of ultra-thin passive chiplets which are 10 \u2013 30 um-thick with chiplet-to-chiplet gaps ranging from 10 \u2013 60 um.\u0026nbsp; To ensure complete chiplet encapsulation using silicon dioxide and achieve near-monolithic integration, we conducted a study to determine the minimum chiplet-to-chiplet gap required for a specific chiplet thickness. Additionally, we discuss methods for transferring extremely thin (\u0026lt; 35 um) reconstituted-SiO2 tiers for post-processing. Furthermore, we demonstrate the ability to fabricate high-density vertical interconnects (through-oxide-vias) with via diameters ranging from 2 \u2013 5 um and pitches ranging from 4 \u2013 15 um, resulting in a \u0026gt;10x increase in vertical interconnect density compared to conventional epoxy-based fan-out wafer-level packages. We also present a testbed showcasing fine-pitch lateral interconnects with a line\/spacing of 2.8\/2 um. Future work will involve demonstrating the proposed reconstitution technology for multi-height chiplet assemblies. We also aim to demonstrate the ability to integrate the SiO2-based reconstituted chiplet tiers in 3D. Finally, we plan to evaluate the die-to-die signaling for this packaging solution using compact circuit models and benchmark it against state-of-the-art 2.5D\/3D HI architectures.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Wafer-scale Chiplet Reconstitution Technology for High-density Heterogeneous Integration"}],"uid":"28475","created_gmt":"2024-11-08 09:01:33","changed_gmt":"2024-11-08 09:03:08","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2024-11-18T10:00:00-05:00","event_time_end":"2024-11-18T12:00:00-05:00","event_time_end_last":"2024-11-18T12:00:00-05:00","gmt_time_start":"2024-11-18 15:00:00","gmt_time_end":"2024-11-18 17:00:00","gmt_time_end_last":"2024-11-18 17:00:00","rrule":null,"timezone":"America\/New_York"},"location":"Room 102A, MiRC","extras":[],"related_links":[{"url":"https:\/\/teams.microsoft.com\/l\/meetup-join\/19%3ameeting_NzUyMWQ3MTUtNzIwOC00NjFkLThkZmQtMWJlYWE4OTkwNGY5%40thread.v2\/0?context=%7b%22Tid%22%3a%22482198bb-ae7b-4b25-8b7a-6d7f32faa083%22%2c%22Oid%22%3a%2205646042-9e29-48aa-bb0c-c2cadb331749%22%7d","title":"Microsoft Teams Meeting link"}],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}