{"674853":{"#nid":"674853","#data":{"type":"news","title":"Zheng Wins Best Paper Award for Advanced Packaging Technologies","body":[{"value":"\u003Cp\u003EGeorgia Tech School of Electrical and Computer Engineering graduate Ting Zheng won an\u003Ca href=\u0022https:\/\/ieeexplore.ieee.org\/xpl\/RecentIssue.jsp?punumber=5503870\u0022\u003E IEEE Transactions on Components, Packaging and Manufacturing Technology\u003C\/a\u003E (TCPMT) Best Paper Award, from the Advanced Packaging Category, for his research on fused-silica stitch-chip technology.\u003C\/p\u003E\u003Cp\u003ETCPMT is the flagship journal of the IEEE Electronics Packaging Society (EPS).\u003C\/p\u003E\u003Cp\u003EHe was recognized for the paper he co-authored prior to his graduation, \u201cBenchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips with Compressible Microinterconnects for RF\/mm-Wave Chiplet-Based Modules.\u201d\u003C\/p\u003E\u003Cp\u003EIt proposes and benchmarks \u2018fused-silica stitch-chips\u2019 \u0026nbsp;as an interconnect technology between neighboring RF\/mm-wave chiplets. Compared to conventional advanced packaging technologies, the stitch-chips enable low-loss and broadband interconnection, provide built-in mechanical deformation capability to compensate for differing chiplets heights, and provide a path towards package size scaling for large-scale multichiplet integration.\u003C\/p\u003E\u003Cp\u003EHe was advised by ECE Professor and 3D Systems Packaging Research Center Director \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/muhannad-s-bakir\u0022\u003EMuhannad Bakir.\u003C\/a\u003E\u003C\/p\u003E\u003Cp\u003EZheng is the second student from Bakir\u2019s Integrated 3D Systems Lab to have their research recognized. Shengtao Yu \u003Ca href=\u0022https:\/\/ece.gatech.edu\/news\/2024\/03\/yu-wins-outstanding-paper-award-electronic-components-and-technology-conference\u0022\u003Ewon the Intel Outstanding Student Paper Award\u003C\/a\u003E for this paper on co-packaged optics and fiber-chiplet-connectors at the 2023 IEEE Electronic Components and Technology Conference (ECTC), which is the flagship conference of IEEE EPS.\u003C\/p\u003E\u003Cp\u003EIt is a rare honor for the same research group to win paper awards in the same year from both ECTC and TCPMT.\u003C\/p\u003E\u003Cp\u003EAt the end of May, Zheng, Yu and Bakir will all attend ECTC 2024 in Denver, CO to receive the ECTC and TCPMT paper awards.\u0026nbsp;\u003Cbr\u003E\u0026nbsp;\u003C\/p\u003E","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe ECE Ph.D. alumni won the award for his research on fused-silica stitch-chip technology for RF\/mm-wave multichiplet modules.\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"The ECE Ph.D. alumni won the award for his research on fused-silica stitch-chip technology for RF\/mm-wave multichiplet modules."}],"uid":"36558","created_gmt":"2024-05-22 18:06:01","changed_gmt":"2024-05-22 18:16:52","author":"zwiniecki3","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2024-05-22T00:00:00-04:00","iso_date":"2024-05-22T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"674057":{"id":"674057","type":"image","title":"Zheng Award.jpg","body":null,"created":"1716401747","gmt_created":"2024-05-22 18:15:47","changed":"1716401747","gmt_changed":"2024-05-22 18:15:47","alt":"Ting Zheng","file":{"fid":"257525","name":"Zheng Award.jpg","image_path":"\/sites\/default\/files\/2024\/05\/22\/Zheng%20Award.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/2024\/05\/22\/Zheng%20Award.jpg","mime":"image\/jpeg","size":396686,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/2024\/05\/22\/Zheng%20Award.jpg?itok=ari5Xysz"}}},"media_ids":["674057"],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"145","name":"Engineering"}],"keywords":[],"core_research_areas":[{"id":"39471","name":"Materials"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EZack Winiecki\u003C\/p\u003E","format":"limited_html"}],"email":["zwiniecki3@gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}