{"673400":{"#nid":"673400","#data":{"type":"news","title":"Yu Wins Outstanding Paper Award at Electronic Components and Technology Conference","body":[{"value":"\u003Cp\u003EShengtao Yu won the Intel Outstanding Student Paper Award at the 2023 IEEE \u003Ca href=\u0022https:\/\/www.ectc.net\/\u0022\u003EElectronic Components and Technology Conference\u003C\/a\u003E (ECTC) in Orlando, Fla.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EHe presented his paper, \u201cScalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy,\u201d at the conference in June 2023 and was recently notified of the outstanding paper recognition.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe paper explored co-packaged optics (CPO) for next generation AI and mm-wave electronic systems, which will require optical connectivity in very close proximity to the electronics.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u201cI got valuable technical feedback from the audience,\u201d said Yu, a Ph.D. candidate in the \u003Ca href=\u0022https:\/\/ece.gatech.edu\/\u0022\u003ESchool of Electrical and Computer Engineering\u003C\/a\u003E.\u202f\u201cI also learned more about the exciting trends in the packaging industry.\u201d\u003C\/p\u003E\r\n\r\n\u003Cp\u003EHis co-authors were his Ph.D. advisor \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/muhannad-s-bakir\u0022\u003EMuhannad Bakir\u003C\/a\u003E and\u202fco-advisor ECE Regents Professor \u003Ca href=\u0022https:\/\/ece.gatech.edu\/directory\/thomas-k-gaylord\u0022\u003EThomas Gaylord.\u003C\/a\u003E\u0026nbsp;Bakir also serves as the Interim Director of the GT \u003Ca href=\u0022https:\/\/sites.gatech.edu\/ien-prc\/\u0022\u003E3D Systems Packaging Research Center\u003C\/a\u003E (PRC).\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe research presented innovative design and technology to enable the passive alignment and interconnection of an array of optical fibers to an underlying photonic integrated circuit (PIC). The key to the demonstrated technology is a passive silicon chiplet, which contains 3D printed slots for fiber insertion, that precisely self-aligns to an underlying PIC at sub-micron scale.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis has the potential to eliminate active alignment techniques commonly used in photonics packaging and enable a scalable and silicon-based solution to fiber alignment and coupling. Photonic interconnection between modern 2.5D packages with PICs and optical fibers is a current key bottleneck.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis work will potentially lead to improved and scalable CPO architectures, enabling massive off-package bandwidth and reduced energy consumption\u202fof interconnects in data centers, which will be important to meet the rapidly increasing packaging demands of artificial intelligence applications and beyond.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe work was supported by the United States Air Force under Contract FA8650-20-C-1003 and in part by the Georgia Tech Institute for Coordinated Infrastructure (NNCI), through the National Science Foundation under Grant ECCS-2025462.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EYu plans to continue this research in Bakir\u2019s Integrated 3D Systems Group to create more robust and scalable designs that are compatible with the latest semiconductor technology.\u003C\/p\u003E\r\n","summary":"","format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EThe ECE Ph.D. candidate was recognized for his research on next generation co-packaged optics.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"The ECE Ph.D. candidate was recognized for his research on next generation co-packaged optics."}],"uid":"36558","created_gmt":"2024-03-07 19:05:48","changed_gmt":"2024-03-08 15:56:03","author":"zwiniecki3","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2024-03-07T00:00:00-05:00","iso_date":"2024-03-07T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"673337":{"id":"673337","type":"image","title":"Shengtao SQ Graphic.jpg","body":null,"created":"1709837968","gmt_created":"2024-03-07 18:59:28","changed":"1709837953","gmt_changed":"2024-03-07 18:59:13","alt":"Shengtao Yu","file":{"fid":"256721","name":"Shengtao SQ Graphic.jpg","image_path":"\/sites\/default\/files\/2024\/03\/07\/Shengtao%20SQ%20Graphic.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/2024\/03\/07\/Shengtao%20SQ%20Graphic.jpg","mime":"image\/jpeg","size":978595,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/2024\/03\/07\/Shengtao%20SQ%20Graphic.jpg?itok=DlRBP0y8"}}},"media_ids":["673337"],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"145","name":"Engineering"},{"id":"8862","name":"Student Research"}],"keywords":[{"id":"193557","name":"co-packaged optics"},{"id":"193558","name":"CPO"},{"id":"125461","name":"ECTC"},{"id":"193559","name":"Outstanding Paper Award"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EZachary Winiecki\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["zwiniecki3@gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}