65662 news 1303211110 1475896114 <![CDATA[Congratulations to Qiao Chen and hir Advisor, Rao Tummala, on winning a IEEE 2011 ECTC Travel Award]]> Congratulations to Qiao Chen and his Advisor, Rao Tummala, on winning the IEEE 2011 ECTC Travel Award for “Low-Cost, Panel-based Silicon Interposer with Fine- Pitch Through-Package-Vias” at the 61th IEEE Electronic Components and Technology Conference, which will be held in Lake Buena Vista, Florida this coming June. This honor is shared with coauthors Mr. Tapobrata Bandyopadhyay, Dr. Fuhan Liu, Dr. Venky Sundaram, Dr. Raghuram Pucha, Prof. Madhavan Swaminathan, Prof. Rao Tummala of Georgia Tech along with Mr. Yuya Suzuki of Zeon Corporation.

CMOS-based ICs are viewed as beginning to reach performance limits beyond 16 nm, and the industry focus, therefore, has begun to change to 3D IC stacking for shortest interconnection length using through-silicon-vias (TSVs). These 3D ICs, however, require 20-50 µm pitch off chip interconnections to package them, as opposed to the current 150 µm pitch for 2D ICs currently. Silicon interposers are being developed widely around the globe, as organic interposers reach their limits in I/Os, thermal dissipation, mechanical stress and warpage due to the large CTE mismatch between silicon devices and organic interposers. However, the current approach, based on 200-300 mm wafers may be too expensive for many consumer electronics applications. The paper presents, for the first time, a radically different panel-based polycrystalline silicon interposer with the potential to achieve highest I/Os at significantly lower cost. 

Congratulations, Qiao!

]]> 2011-04-19T00:00:00-04:00 Congratulations to Qiao Chen and hir Advisor, Rao Tummala, on winning a IEEE 2011 ECTC Travel Award

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