{"65662":{"#nid":"65662","#data":{"type":"news","title":"Congratulations to Qiao Chen and hir Advisor, Rao Tummala, on winning a IEEE 2011 ECTC Travel Award","body":[{"value":"\u003Cp\u003ECongratulations to Qiao Chen and his Advisor, Rao Tummala, on winning\nthe IEEE 2011 ECTC Travel Award for \u201cLow-Cost, Panel-based Silicon Interposer\nwith Fine- Pitch Through-Package-Vias\u201d at the 61th IEEE Electronic Components\nand Technology Conference, which will be held in Lake Buena Vista, Florida this\ncoming June. This honor is shared with coauthors Mr. Tapobrata Bandyopadhyay,\nDr. Fuhan Liu, Dr. Venky Sundaram, Dr. Raghuram Pucha, Prof. Madhavan\nSwaminathan, Prof. Rao Tummala of Georgia Tech along with Mr. Yuya Suzuki of\nZeon Corporation.\u003C\/p\u003E\n\n\u003Cp\u003ECMOS-based ICs are viewed as beginning to reach performance\nlimits beyond 16 nm, and the industry focus, therefore, has begun to change to\n3D IC stacking for shortest interconnection length using through-silicon-vias\n(TSVs). These 3D ICs, however, require 20-50 \u00b5m pitch off chip interconnections\nto package them, as opposed to the current 150 \u00b5m pitch for 2D ICs currently. Silicon\ninterposers are being developed widely around the globe, as organic interposers\nreach their limits in I\/Os, thermal dissipation, mechanical stress and warpage\ndue to the large CTE mismatch between silicon devices and organic interposers.\nHowever, the current approach, based on 200-300 mm wafers may be too expensive\nfor many consumer electronics applications. The paper presents, for the first\ntime, a radically different panel-based polycrystalline silicon interposer with\nthe potential to achieve highest I\/Os at significantly lower cost.\u0026nbsp; \u003C\/p\u003E\n\n\u003Cp\u003ECongratulations, Qiao!\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":[{"value":"Congratulations to Qiao Chen and hir Advisor, Rao Tummala, on winning a IEEE 2011 ECTC Travel Award"}],"field_summary":[{"value":"\u003Cp\u003ECongratulations to Qiao Chen and hir Advisor, Rao Tummala,\non winning a IEEE 2011 ECTC Travel Award\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":[{"value":"Congratulations to Qiao Chen and hir Advisor, Rao Tummala, on winning a IEEE 2011 ECTC Travel Award"}],"uid":"27388","created_gmt":"2011-04-19 11:05:10","changed_gmt":"2016-10-08 03:08:34","author":"Bill Miller","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2011-04-19T00:00:00-04:00","iso_date":"2011-04-19T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"groups":[{"id":"1238","name":"School of Materials Science and Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"}],"keywords":[{"id":"11005","name":"MSE_Internal_NEWS"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}