System integration and miniaturization demands are driving integrated thin film capacitor technologies with ultra-high capacitance densities for noise-free power supply, power conversion and efficient power management. There is also a new emerging need for voltage regulation and power supply in bio-electronic and portable consumer products that is driving up the capacitance densities to above 100µF/cm² with high Breakdown Voltages (BDV) and low leakage current. The volumetric efficiency of high-density capacitors, however, has only gone through incremental changes over the past few decades because of several fundamental limitations.  This paper describes an innovative approach to achieve very high capacitance density on silicon interposers than what has been reported with trench capacitors. The approach consists of a novel silicon-compatible, low-temperature sinterable metal particulate electrode and a conformal moderate-permittivity dielectric to attain the high capacitance density with high volumetric efficiency.

Congratulations, Kanika!