{"65661":{"#nid":"65661","#data":{"type":"news","title":"Congratulations to Kania Sethi and her Advisor, Rao Tummala, on winning the IEEE 2011 ECTC Travel Award","body":[{"value":"\u003Cp\u003ECongratulations to Kania Sethi and her Advisor, Rao Tummala, on winning\nthe IEEE 2011 ECTC Travel Award for \u201cConformal Atomic Layer Deposition (ALD) of\nAlumina on High Surface-Area Porous Copper Electrodes to Achieve Ultra-High\nCapacitance Density on Silicon\u201d at the 61th IEEE Electronic Components and\nTechnology Conference, which will be held in Lake Buena Vista, Florida this\ncoming June. This honor is shared with coauthors Dr. Himani Sharma, Dr. PM Raj,\nProf. Rao Tummala of Georgia Tech along with Mr. Andy Fenner and Ms. Anna Malin\nof Medtronics.\u003C\/p\u003E\n\n\u003Cp\u003ESystem integration and miniaturization demands are driving\nintegrated thin film capacitor technologies with ultra-high capacitance\ndensities for noise-free power supply, power conversion and efficient power\nmanagement. There is also a new emerging need for voltage regulation and power\nsupply in bio-electronic and portable consumer products that is driving up the\ncapacitance densities to above 100\u00b5F\/cm\u003Csup\u003E2\u003C\/sup\u003E with high Breakdown\nVoltages (BDV) and low leakage current. The volumetric efficiency of\nhigh-density capacitors, however, has only gone through incremental changes\nover the past few decades because of several fundamental limitations.\u0026nbsp; This paper describes an innovative approach\nto achieve very high capacitance density on silicon interposers than what has\nbeen reported with trench capacitors. The approach consists of a novel silicon-compatible,\nlow-temperature sinterable metal particulate electrode and a conformal moderate-permittivity\ndielectric to attain the high capacitance density with high volumetric\nefficiency.\u003C\/p\u003E\n\n\u003Cp\u003ECongratulations, Kanika!\u003C\/p\u003E","summary":null,"format":"limited_html"}],"field_subtitle":[{"value":"Congratulations to Kania Sethi and her Advisor, Rao Tummala, on winning a IEEE 2011 ECTC Travel Award"}],"field_summary":[{"value":"\u003Cp\u003ECongratulations to Kania Sethi and her Advisor, Rao Tummala, on winning the IEEE 2011 ECTC Travel Award\u003C\/p\u003E","format":"limited_html"}],"field_summary_sentence":"","uid":"27388","created_gmt":"2011-04-19 11:04:14","changed_gmt":"2016-10-08 03:08:34","author":"Bill Miller","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2011-04-19T00:00:00-04:00","iso_date":"2011-04-19T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"groups":[{"id":"1238","name":"School of Materials Science and Engineering"}],"categories":[],"keywords":[{"id":"11005","name":"MSE_Internal_NEWS"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}