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  <title><![CDATA[Ph.D. Proposal Oral Exam - Jinbang Fu]]></title>
  <body><![CDATA[<p><strong>Title:&nbsp; </strong><em>THz Wireless Channel Characterization and Modeling for Chip-to-Chip Communication in Computing Systems</em></p>

<p><strong>Committee:&nbsp; </strong></p>

<p>Dr. Zajic, Advisor</p>

<p>Dr. Peterson, Chair</p>

<p>Dr. Durgin</p>

<p><strong>Abstract: </strong>The objective of the proposed research is to characterize and model the THz wireless channel in metal enclosures for chip-to-chip communication. The research starts with the measurements inside a desktop size metal cavity with the consideration of several potential scenarios. The first objective is to understand the signal propagation mechanisms in a metal enclosure. Based on the measurement findings, the second objective is to propose the path loss model for THz chip-to-chip communication. According to the cavity environment and the statistical properties of the channel inside the metal cavity, the third objective is to build geometry based statistical channel model. Afterwards, the objective is to investigate more complicate environment by putting the densely populated motherboard in the metal cavity and perform channel characterization and modeling for this practical environment.</p>
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