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  <title><![CDATA[Ph.D. Proposal Oral Exam - Jeongseok Lee]]></title>
  <body><![CDATA[<p><strong>Title:&nbsp; </strong><em>Hybrid Digital PA and Bidirectional Digital Transceiver Circuits in Silicon</em></p>

<p><strong>Committee:&nbsp; </strong></p>

<p>Dr. Wang, Advisor</p>

<p>Dr. Raychowdhury, Chair</p>

<p>Dr. Swaminathan</p>

<p><strong>Abstract: </strong>The objective of the proposed research is to develop silicon based digital RF frontends to offer excellent RF performance and extensive reconfigurability.&nbsp; Advent of Internet-of-Things (IoT), communication devices that most people carry on and smart factories are causing a surge of connected devices and proliferation of wireless sensor nodes. Modern communication systems, which need to be connected everywhere and at all times, require each device to be a small size, and require stringent standards for the RF systems. From a transmitter perspective, in face of explosive increase in data rates requires high speed complex modulation schemes with high spectral efficiency and large peak-to-average power ratios (PAPRs), such as high-order quadrature amplitude modulations (QAMs) and orthogonal frequency-division multiplexing (OFDM). From a receiver perspective, massive RF applications lead to a crowed spectrum, making receivers susceptible to mutual interference. Hence, along with cost and power consumption, interference robustness is becoming a major concern for the radios targeting these applications. This proposal focuses on the design of digital power amplifier and transceiver, which can be one of solutions for these requirements.</p>
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