{"645278":{"#nid":"645278","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Joe Gonzalez","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle\u003C\/strong\u003E\u003Cem\u003E:\u0026nbsp; \u003C\/em\u003E\u003Cem\u003EHeterogeneous Integration of Chiplets Using Socketed Platforms, Off-Chip Flexible Interconnects, and Self-Alignment Technologies\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Muhannad Bakir, ECE, Chair , Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Oliver Brand, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Hua Wang, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Adilson Cardoso, GTRI\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Suresh Sitaraman, ME\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract:\u0026nbsp;\u003C\/strong\u003EThe heterogeneous integration of chiplets addresses many of the technical and logistical challenges associated with SoCs to meet the ever-increasing demands from a variety of emerging markets including IoT and mm-wave 5G. These integrated systems are conventionally permanently integrated\/interconnected in a fixed configuration via either microbumps or other advanced off-chip interconnect technologies. However, some applications require the heterogeneity and fine-pitch provided by these multi-chiplet polylithic systems while also requiring a non-permanent or replaceable setup to meet a variety of needs or to enable a variety of applications: reworkability, testing, prototyping, upgradeability, etc. Furthermore, as systems integrate a growing number of chiplets, package\/system yield can suffer considerably when in a permanent configuration; a replaceable setup can directly address this problem. To address the aforementioned challenges, this research presents novel, replaceable heterogeneously integrated systems using socketed platforms for different targeted applications. In general, such a system requires two enabling technologies: 1) a non-permanent off-chip interconnection system and 2) a non-permanent alignment technology. Hence, this research also introduces the design, fabrication, and characterization of off-chip flexible interconnects and mechanically-based self-alignment technologies.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Heterogeneous Integration of Chiplets Using Socketed Platforms, Off-Chip Flexible Interconnects, and Self-Alignment Technologies "}],"uid":"28475","created_gmt":"2021-03-12 14:05:33","changed_gmt":"2021-03-12 14:05:33","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2021-03-23T12:30:00-04:00","event_time_end":"2021-03-23T14:30:00-04:00","event_time_end_last":"2021-03-23T14:30:00-04:00","gmt_time_start":"2021-03-23 16:30:00","gmt_time_end":"2021-03-23 18:30:00","gmt_time_end_last":"2021-03-23 18:30:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}