Committee:

Dr. Manos Tentzeris, ECE, Chair , Advisor

Dr. Gregory Durgin, ECE

Dr. Andrew Peterson, ECE

Dr. Benjamin Cook, TI

Dr. Pulugurtha Raj, FIU

Abstract: This thesis outlines the convergence of additive manufacturing (AM) technology with the development of system-in-package (SiP) integration schemes for millimeter-wave (mm-Wave) wireless systems. First-of-their-kind demonstrations of fundamental system and package components, such as high gain antennas, interconnects, and “smart” chip encapsulants, are presented utilizing fully-additive printing methods. The technologies outlined in these efforts highlight the potential for AM to further increase the design flexibility of mm-Wave systems at the module and device level, offering a new precedent of rapid, application-specific reconfigurability for the next generation of wireless technology.