Committee: 

Dr. Bakir, Advisor

Dr. Brand, Chair

Dr. Frazier

Abstract: The objective of the proposed research contains two parts. The first part of the research is about developing ALD Co bonding to achieve a wafer-level batch-bonding process that has a sub-micron I/O pitch, a low bonding temperature, a low surface- treatment requirement, and the capability for multi-pitch/multi-diameter. The second part of the research use low-temperature PECVD Si/SiO2 to encapsulate multiple chiplets and form reconstituted wafer to achieve a high density, wafer-level, BEOL-integrated, multi-tier stacked 3D fan-out wafer-level package (FOWLP).