{"641608":{"#nid":"641608","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Ming Jui Li","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EUltra-dense 3D Heterogeneous Integration Interconnect and Assembly\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u0026nbsp; \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Bakir, Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Brand, Chair\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Frazier\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003EThe objective of the proposed research contains two parts. The first part of the research is about developing ALD Co bonding to achieve a wafer-level batch-bonding process that has a sub-micron I\/O pitch, a low bonding temperature, a low surface- treatment requirement, and the capability for multi-pitch\/multi-diameter. The second part of the research use low-temperature PECVD Si\/SiO2 to encapsulate multiple chiplets and form reconstituted wafer to achieve a high density, wafer-level, BEOL-integrated, multi-tier stacked 3D fan-out wafer-level package (FOWLP).\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Ultra-dense 3D Heterogeneous Integration Interconnect and Assembly"}],"uid":"28475","created_gmt":"2020-11-23 22:53:18","changed_gmt":"2020-11-23 22:53:18","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2020-12-04T15:00:00-05:00","event_time_end":"2020-12-04T17:00:00-05:00","event_time_end_last":"2020-12-04T17:00:00-05:00","gmt_time_start":"2020-12-04 20:00:00","gmt_time_end":"2020-12-04 22:00:00","gmt_time_end_last":"2020-12-04 22:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}