Committee:

Dr. Rao Tummala, ECE, Chair , Advisor

Dr. Andrew Peterson, ECE

Dr. Madhavan Swaminathan, ECE

Dr. Mohanalingam Kathaperumal, PRC

Dr. Eric Vogel, MSE

Abstract: The objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, high-performance ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin low-warpage GPE packages were demonstrated with thickness less than 150 µm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.12 dB at 77 GHz enabled by ultra-low loss dielectric, and high precision processing with minimal variations in line and via geometries on glass substrates. A die-package codesign was proposed for high-frequency characterization of ultra-thin GPE package for mm-Wave applications.