Committee:

Dr. Rao Tummala, ECE, Chair , Advisor

Dr. Vanessa Smet, ME, Co-Advisor

Dr. Madhavan Swaminathan, ECE

Dr. Shyh-Chiang Shen, ECE

Dr. Maryam Saeedifard, ECE

Dr. Yogendra Joshi, ME

Abstract: The objectives of this research were to design and demonstrate a new class of ultra-low parasitics, 3D power module for EV/HEV applications with high dv/dt capability, and enhanced thermal management and thermomechanical reliability. In order to address the challenges associated with SiC power module packaging technologies including, switching waveform distortion (overshoot and resonance) by parasitic inductance, high-level of noise generated from increased dv/dt and parasitic capacitance, and high-thermal densities that could potentially aggravate package reliability, a leadframe-based 3D stacked power module design was introduced and demonstrated. This unique approach is highly modular and compatible with current and future manufacturing infrastructures and processes, making it a suitable manufacturing process for low-cost, high-volume mass production, and yielding a compact 3D stacked package.