{"634330":{"#nid":"634330","#data":{"type":"event","title":"PhD Proposal by Omkar Gupte","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETHE SCHOOL OF MATERIALS SCIENCE AND ENGINEERING\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EGEORGIA INSTITUTE OF TECHNOLOGY\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EUnder the provisions of the regulations for the degree\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\n\u003Cstrong\u003EDOCTOR OF PHILOSOPHY\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\n\u003Cstrong\u003Eon Tuesday, April 21, 2020\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003E12:15 PM\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003Evia\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EWebEx\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003E\u003Ca href=\u0022https:\/\/gatech.webex.com\/gatech\/j.php?MTID=mabbe179000a1e4c5416a7b488c247c47\u0022\u003Ehttps:\/\/gatech.webex.com\/gatech\/j.php?MTID=mabbe179000a1e4c5416a7b488c247c47\u003C\/a\u003E\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003Ewill be held the\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EDISSERTATION PROPOSAL DEFENSE\u003C\/strong\u003E\u003Cbr \/\u003E\r\n\u003Cbr \/\u003E\r\n\u003Cstrong\u003Efor\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EOmkar Gupte\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003E\u0026quot;Modeling, Design and Demonstration of Innovative Surface-Mountable and Socketable Board-Level Interconnection Technology \u0026quot;\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee Members:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EProf. Rao Tummala, Advisor, ECE\/MSE\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EProf. Vanessa Smet, Co-advisor, ME\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EProf. Preet Singh, MSE\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EProf. CP Wong, MSE\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EGregorio Murtagian, Ph.D, Intel Corporation\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBall Grid Array (BGA) architectures are being widely used in the semiconductor industry in surface mount (SMT) applications to satisfy the miniaturization needs of emerging microelectronics systems. However, these architectures are not compatible with socketing applications as the mechanical contact between the Au paddle and the solder sphere leads to undesirable reactions, increasing the contact resistance and degrading reworkability over time. To address this challenge, surface modification of BGA spheres with multilayered thin-film metallic coatings such as Ni-Au and Bi-Au is proposed to maintain a non-reactive noble metal interface when used in a socket. This proposal provides details of the studies conducted in this research, including (1) diffusion modeling and design of such coatings with a fundamental understanding of the trade-offs between SMT and socketing applications, (2) the development, characterization and optimization of the modified BGA balls coating and attach processes using an in-house developed, hybrid sputtering\/electroless deposition process and conventional mass reflow with solder paste, respectively, as well as (3) thermal aging characterization of the modified BGA packages. These preliminary results establish the proposed approach as a promising technology towards the development of a reliable, universal BGA solution.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Modeling, Design and Demonstration of Innovative Surface-Mountable and Socketable Board-Level Interconnection Technology "}],"uid":"27707","created_gmt":"2020-04-13 19:59:57","changed_gmt":"2020-04-13 19:59:57","author":"Tatianna Richardson","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2020-04-21T13:15:00-04:00","event_time_end":"2020-04-21T15:00:00-04:00","event_time_end_last":"2020-04-21T15:00:00-04:00","gmt_time_start":"2020-04-21 17:15:00","gmt_time_end":"2020-04-21 19:00:00","gmt_time_end_last":"2020-04-21 19:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"221981","name":"Graduate Studies"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78761","name":"Faculty\/Staff"},{"id":"78771","name":"Public"},{"id":"174045","name":"Graduate students"},{"id":"78751","name":"Undergraduate students"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}