{"628055":{"#nid":"628055","#data":{"type":"news","title":"Rajan Tapped for IEEE 3DIC Best Student Paper Honors","body":[{"value":"\u003Cp\u003ESreejith Kochupurackal Rajan received the Best Student Paper Award at the 2019 IEEE International 3D Systems Integration Conference (3DIC), held October 8-10 in Sendai, Japan. Rajan is a Ph.D. student in the Georgia Tech School of Electrical and Computer Engineering (ECE) and is a member of the Integrated 3D Systems Group.\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe title of Rajan\u0026rsquo;s award winning paper is \u0026ldquo;High density and low-temperature interconnection enabled by mechanical self-alignment and electroless plating.\u0026rdquo; His coauthors on the paper are Ming Jui (Carl) Li, a fellow ECE Ph.D. student in the Integrated 3D Systems Group; Muhannad Bakir, Rajan\u0026rsquo;s and Li\u0026rsquo;s Ph.D. advisor and the Dan Fielder Professor in ECE; and Gary May, an ECE adjunct faculty member and chancellor of the University of California at Davis.\u003C\/p\u003E\r\n\r\n\u003Cp\u003EModern compute workloads require hardware capabilities which cannot be provided by the ever-slowing transistor scaling. Especially, machine learning (ML) applications require densely integrated compute and memory fabric, which cannot be met with today\u0026#39;s technologies. This has driven the recent surge towards heterogenous integration, where advanced 2.5D and 3D integrated circuits (ICs) complement System-on-Chip (SoC) innovations to provide high performance, low cost, and more customizable System-in-Packages (SiPs). In this work, Rajan and his coauthors present two key enabling technologies for SiP scaling.\u003C\/p\u003E\r\n\r\n\u003Cp\u003ERajan and his coauthors present and discuss the use of mechanical self-alignment in conjunction with metal electroless deposition as a method to facilitate low temperature, low pressure, and high interconnect density inter-die bonding in heterogeneous 2.5D and 3D ICs. This method is a highly scalable alternative to the conventional solder-based interconnects, but comes without the stringent requirements including high temperature tolerance, high pressure process, extreme surface planarity and cleanliness, and very accurate initial alignment requirements of Cu-Cu (copper-copper) direct bonding. The conjunction with mechanical self-alignment, which has demonstrated sub-micron alignment accuracies, also helps scale the pitch easily, as well as provide a platform to create SiPs with a large number of individual chiplets.\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EPhoto Information\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ETop photo:\u0026nbsp;\u003C\/strong\u003ESreejith Kochupurackal Rajan\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EBottom photo:\u003C\/strong\u003E\u0026nbsp;Sreejith Kochupurackal Rajan (right) is pictured with\u0026nbsp;Professor\u0026nbsp;Tetsu Tanaka of Tohoku University, Japan. Tanaka was a co-chair of the 2019 3DIC Conference\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Ph.D. student\u0026nbsp;Sreejith Kochupurackal Rajan received the Best Student Paper Award at the 2019 IEEE International 3D Systems Integration Conference (3DIC), held October 8-10 in Sendai, Japan.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Ph.D. student\u00a0Sreejith Kochupurackal Rajan received the Best Student Paper Award at the 2019 IEEE International 3D Systems Integration Conference (3DIC), held October 8-10 in Sendai, Japan."}],"uid":"27241","created_gmt":"2019-10-24 18:16:13","changed_gmt":"2019-10-24 18:34:22","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2019-10-24T00:00:00-04:00","iso_date":"2019-10-24T00:00:00-04:00","tz":"America\/New_York"},"extras":[],"hg_media":{"628058":{"id":"628058","type":"image","title":"Sreejith Kochupurackal Rajan ","body":null,"created":"1571941781","gmt_created":"2019-10-24 18:29:41","changed":"1571941804","gmt_changed":"2019-10-24 18:30:04","alt":"photograph of Sreejith Kochupurackal Rajan","file":{"fid":"239158","name":"Potrait_pic.jpg","image_path":"\/sites\/default\/files\/images\/Potrait_pic_0.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/Potrait_pic_0.jpg","mime":"image\/jpeg","size":471555,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Potrait_pic_0.jpg?itok=9klAB9fr"}},"628056":{"id":"628056","type":"image","title":"Sreejith Kochupurackal Rajan (right) with Professor Tetsu Tanaka ","body":null,"created":"1571941587","gmt_created":"2019-10-24 18:26:27","changed":"1571941587","gmt_changed":"2019-10-24 18:26:27","alt":"photograph of Sreejith Kochupurackal Rajan (right) with Professor Tetsu Tanaka ","file":{"fid":"239156","name":"Award_Ceremony.JPG","image_path":"\/sites\/default\/files\/images\/Award_Ceremony.JPG","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/Award_Ceremony.JPG","mime":"image\/jpeg","size":408788,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/Award_Ceremony.JPG?itok=NXk6zkSY"}}},"media_ids":["628058","628056"],"related_links":[{"url":"http:\/\/www.bakirlab.gatech.edu","title":"Integrated 3D Systems Group"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"https:\/\/3dic-conf.org","title":"IEEE International 3D Systems Integration Conference (3DIC)"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"134","name":"Student and Faculty"},{"id":"8862","name":"Student Research"},{"id":"135","name":"Research"},{"id":"153","name":"Computer Science\/Information Technology and Security"},{"id":"144","name":"Energy"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"182771","name":"Sreejith Kochupurackal Rajan"},{"id":"12093","name":"Muhannad Bakir"},{"id":"182772","name":"IEEE 3DIC"},{"id":"182773","name":"IEEE International 3D Systems Integration Conference"},{"id":"55281","name":"Integrated 3D Systems Group"},{"id":"182774","name":"interconnection"},{"id":"182775","name":"electroless plating"},{"id":"182776","name":"modern compute workloads"},{"id":"182777","name":"transistor scaling"},{"id":"9167","name":"machine learning"},{"id":"182778","name":"compute fabric"},{"id":"182779","name":"memory fabric"},{"id":"180827","name":"heterogeneous integration"},{"id":"182780","name":"2.5D integrated circuits"},{"id":"172977","name":"3D integrated circuits"},{"id":"169992","name":"system-on-chip"},{"id":"182781","name":"system-in-package"},{"id":"182220","name":"chipsets"}],"core_research_areas":[{"id":"39431","name":"Data Engineering and Science"},{"id":"39451","name":"Electronics and Nanotechnology"},{"id":"39531","name":"Energy and Sustainable Infrastructure"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}