{"627757":{"#nid":"627757","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Md Obaidul Hossen","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp;\u003C\/strong\u003E\u003Cem\u003EPower Delivery and Thermal Consideration for 2.5-D and 3-D Integration Technologies\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee\u003C\/strong\u003E:\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Muhannad Bakir, ECE Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Azad Naeemi, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Arijit Raychowdhury, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Tushar Krishna, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Yogendra Joshi, ME\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract:\u003C\/strong\u003EOwing to advanced technologies, the total power density in a high-performance computing system is expected to increase beyond 100 W\/cm2; power delivery becomes a critical challenge, and advanced cooling solutions are turning into a necessity.\u0026nbsp;\u0026nbsp;Moreover, reduced noise margin determined by the scaling trend of the technology is making power delivery to the chip ever more challenging. Placing dice side-by-side poses thermal coupling issues where heat flows from the high-power die to the low-power die. There are also inter-dependencies among these different domains. Therefore, in this research effort, we investigate and benchmark different 2.5-D and 3-D heterogeneous integration technologies on the thermal and electrical performance and their inter-dependencies. We develop a thermally aware power delivery network (PDN) design framework to investigate power supply noise for emerging 2.5-D and 3-D integration technologies. We also present a novel backside-PDN configuration where the PDN is separated from the signaling network of the die.\u0026nbsp;\u0026nbsp;The research tasks will feed into one another in order to develop a more comprehensive pre-design analysis of heterogeneous integration systems\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Power Delivery and Thermal Consideration for 2.5-D and 3-D Integration Technologies"}],"uid":"30864","created_gmt":"2019-10-17 20:57:17","changed_gmt":"2019-10-17 20:57:17","author":"Tasha Torrence","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2019-11-05T09:00:00-05:00","event_time_end":"2019-11-05T11:00:00-05:00","event_time_end_last":"2019-11-05T11:00:00-05:00","gmt_time_start":"2019-11-05 14:00:00","gmt_time_end":"2019-11-05 16:00:00","gmt_time_end_last":"2019-11-05 16:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}