{"626070":{"#nid":"626070","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Paul Jo","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle\u003C\/strong\u003E\u003Cem\u003E:\u0026nbsp; \u003C\/em\u003E\u003Cem\u003EPolylithic Integration Of Heterogeneous Multi-Die Enabled By Compressible Microinterconnects\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Muhannad Bakir, ECE, Chair , Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Oliver Brand, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Tushar Krishna, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Adilson Cardoso, GTRI\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Suresh Sitaraman, ME\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThis research proposes and demonstrate 1) a new compliant interconnect that can provide cost-effective and simple fabrication process and allow high-degree of freedom in design and 2) advanced heterogeneous multi-die integration platform enabled by the new compliant interconnect. Interconnects play a critical role in virtually all microelectronic applications. They are key in influencing microsystem form factor, electrical performance, power consumption, and signal integrity. Of particular importance are first-level interconnects, which are used to electrically interconnect and mechanically bond a die to a package substrate. The density, electrical attributes, and mechanical properties of first-level interconnects impact the overall mechanical integrity, signaling bandwidth density, and power supply noise of microsystems. While solder bumps have become a key technology for first-level interconnects, the technology unfortunately leaves a number of attributes desired in modern microsystems. Compliant interconnects can circumvent many of the challenges in solder bumps as they can compensate for surface non-uniformity on the attaching substrate and CTE mismatch induced warpage and provide non-permanent contact. To this end, novel compliant interconnects for emerging electronic devices and new heterogeneous multi-die integration platform enabled by the compliant interconnects are explored.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Polylithic Integration Of Heterogeneous Multi-Die Enabled By Compressible Microinterconnects "}],"uid":"28475","created_gmt":"2019-09-11 21:31:02","changed_gmt":"2019-09-11 21:31:02","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2019-09-25T15:00:00-04:00","event_time_end":"2019-09-25T17:00:00-04:00","event_time_end_last":"2019-09-25T17:00:00-04:00","gmt_time_start":"2019-09-25 19:00:00","gmt_time_end":"2019-09-25 21:00:00","gmt_time_end_last":"2019-09-25 21:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}