Committee: 

Dr. Tentzeris, Advisor    

Dr. Durgin, Chair

Dr. Peterson

Abstract:

The objective of the proposed research is to outline the design, fabrication, and evaluation of additive manufacturing processes for the realization of highly-integrated, application-specific millimeter-wave system packages. Inkjet and 3D printing processes and materials are characterized for use in wireless system-in-package (SiP) design schemes. The optimization of these processes enable several package-level component demonstrations, where interest is placed upon ramped first-level die-package interconnects and printed SiP antenna integration to collectively reduce system losses, parasitics, and footprint. Additionally, efforts towards fully-printed IC packages further enable "smart" wireless packages, where a variety of system components, including passives, antennas, microfluidics, and more can be included within a single printed package.