{"621157":{"#nid":"621157","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Bijan Tehrani","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EAdditive Manufacturing Solutions for Application-Specific Millimeter-Wave Wireless System Design and Packagin\u003C\/em\u003E\u003Cem\u003Eg\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u0026nbsp; \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Tentzeris, Advisor\u0026nbsp;\u0026nbsp;\u0026nbsp;\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Durgin, Chair\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Peterson\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe objective of the proposed research is to outline the design, fabrication, and evaluation of additive manufacturing processes for the realization of highly-integrated, application-specific millimeter-wave system packages. Inkjet and 3D printing processes and materials are characterized for use in wireless system-in-package (SiP) design schemes. The optimization of these processes enable several package-level component demonstrations, where interest is placed upon ramped first-level die-package interconnects and printed SiP antenna integration to collectively reduce system losses, parasitics, and footprint. Additionally, efforts towards fully-printed IC packages further enable \u0026quot;smart\u0026quot; wireless packages, where a variety of system components, including passives, antennas, microfluidics, and more can be included within a single printed package.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Additive Manufacturing Solutions for Application-Specific Millimeter-Wave Wireless System Design and Packaging"}],"uid":"28475","created_gmt":"2019-05-01 09:19:47","changed_gmt":"2019-05-01 09:19:47","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2019-05-10T11:00:00-04:00","event_time_end":"2019-05-10T13:00:00-04:00","event_time_end_last":"2019-05-10T13:00:00-04:00","gmt_time_start":"2019-05-10 15:00:00","gmt_time_end":"2019-05-10 17:00:00","gmt_time_end_last":"2019-05-10 17:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}