{"618623":{"#nid":"618623","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Mingu Kim","body":[{"value":"\u003Cp\u003E\u003Cem\u003EAll-soft Electronic Devices and Integrated Microsystems Enabled by Liquid Metal\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Oliver Brand, ECE, Chair , Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Omer Inan, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Muhannad Bakir, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Bernard Kippelen, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Seung Woo Lee, ME\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe objective of the dissertation is to explore all-soft electronic devices and integrated microsystems enabled by gallium-based liquid metal (eutectic gallium-indium alloy, EGaIn). The use of conducting liquid, such as EGaIn, has great potential because of its non-toxicity, low melting temperature, and excellent electrical and mechanical properties. However, EGaIn patterning challenges, particularly regarding minimum feature sizes, size-scalability, uniformity, and residue-free surfaces, have limited the demonstration of high-density, soft microelectronic devices. This research focuses on lithography-enabled thin-film patterning techniques for EGaIn structures with dimensions ranging from the nanometer scale to the centimeter scale. The developed multiscale EGaIn patterning techniques in combination with a vertical integration approach using EGaIn-filled soft vias overcome the current limitation in EGaIn fabrication and integration. Combining the scalable fabrication and integration techniques, 3D-integrated, soft functional microsystems were demonstrated for physical strain sensing and chemical environmental sensing applications. In addition, high-performance, soft supercapacitors were demonstrated to ultimately realize fully-integrated soft microsystems.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"All-soft Electronic Devices and Integrated Microsystems Enabled by Liquid Metal "}],"uid":"28475","created_gmt":"2019-02-28 22:16:22","changed_gmt":"2019-02-28 22:16:22","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2019-03-11T12:00:00-04:00","event_time_end":"2019-03-11T14:00:00-04:00","event_time_end_last":"2019-03-11T14:00:00-04:00","gmt_time_start":"2019-03-11 16:00:00","gmt_time_end":"2019-03-11 18:00:00","gmt_time_end_last":"2019-03-11 18:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}