{"612857":{"#nid":"612857","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Reza Abbaspour","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle\u003C\/strong\u003E\u003Cem\u003E:\u0026nbsp; \u003C\/em\u003E\u003Cem\u003EThree-dimensional Micro Fabrication Technologies for Electronic and Lab-on-chip Applications\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Muhannad Bakir, ECE, Chair , Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Azad Naeemi, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Oliver Brand, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Albert Frazier, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Yogendra Joshi, ME\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe density of heterogeneous three-dimensional integrated circuits (3D-ICs) is significantly limited by through-silicon-via (TSV) density and cooling challenges. To enable fine-grain 3D-ICs, high aspect-ratio sub-micron diameter (~920 nm) TSV technology is demonstrated. To address cooling challenges and pronounced thermal wall limits in high-density integrated electronics and 3D-IC technology, a monolithic microfluidic cooling strategy is explored. Specifically, a thermal testbed with non-uniform power map and integrated microfluidics at the back side of the silicon die is microfabricated. While the proposed silicon-based microfluidic cooling is shown to provide thermal benefits, the silicon Bosch process introduces a number of challenges on a fully processed CMOS wafer, in particular introducing crystalline defects, reducing silicon volume and thus increasing wafer warpage. As an alternative, a novel metal additive manufacturing technology is developed as a key enabler for microfabricating a metallic microfluidic heatsink at the die-level and wafer-level. As a result, we demonstrate additively manufactured 200 \u0026micro;m diameter copper (Cu) pillars as the key heat dissipating elements for monolithically integrated microfluidic heatsinks. Lastly, it is discovered that there is a wide need for the scallop-free sub-micron deep silicon etching process that was developed for the high-density 3D-IC project. By leveraging this enabling process, a lab-on-chip device is microfabricated to study, for the first time, bio-physical interactions of red-blood-cells (RBCs) with their surrounding environment in vitro.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Three-dimensional Micro Fabrication Technologies for Electronic and Lab-on-chip Applications "}],"uid":"28475","created_gmt":"2018-10-16 20:47:40","changed_gmt":"2018-10-16 20:47:40","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2018-10-30T15:00:00-04:00","event_time_end":"2018-10-30T17:00:00-04:00","event_time_end_last":"2018-10-30T17:00:00-04:00","gmt_time_start":"2018-10-30 19:00:00","gmt_time_end":"2018-10-30 21:00:00","gmt_time_end_last":"2018-10-30 21:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}