{"601242":{"#nid":"601242","#data":{"type":"event","title":"M.S. Thesis Defense - Chintan Buch","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u003C\/strong\u003E Advances in Embedded Glass Packages for Low Stress and Near Hermetic Reliability\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Rao Tummala, ECE, Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Oliver Brand, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Peter Hesketh, ME \u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Venkatesh Sundaram, PRC\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u0026nbsp;MEMS based sensing is gaining widespread adoption in\u0026nbsp; consumer electronics as well as the next generation Internet of Things (IoT)\u0026nbsp;market. Such applications serve as primary drivers towards miniaturization\u0026nbsp;for increased component density, multi-chip integration, lower cost and\u0026nbsp;better reliability. Traditional approaches like System-on-Chip (SoC) and\u0026nbsp; System on Board (SoB) are not ideal to address these challenges and there is\u0026nbsp;a need to find solutions at package level, through heterogeneous package\u0026nbsp;integration (HPI). However, existing MEMS packaging techniques like\u0026nbsp;laminate\/ceramic substrate packaging and silicon wafer level packaging face\u0026nbsp;challenges like standardization, heterogeneous package integration and form\u0026nbsp;factor miniaturization. Besides, application specific packages take up the\u0026nbsp;largest fraction of the total manufacturing cost. Therefore, advanced\u0026nbsp;packaging of MEMS sensors for HPI plays a critical role in the short and long\u0026nbsp;\u003Cbr \/\u003E\r\nrun towards the SOP vision. This dissertation demonstrates a low stress, reliable, near-hermetic\u0026nbsp;ultra-thin glass cavity MEMS packages as a solution that combines the\u0026nbsp;advantages of LTCC substrates and silicon wafer level packaging while also\u0026nbsp;addressing their limitations. These glass based cavity packages can be scaled\u0026nbsp;down to 2x smaller form factors (\u0026lt;500\u0026mu;m) and are fabricated out of large\u0026nbsp;panel fabrication processes thereby addressing the cost and form factor\u0026nbsp;requirements of MEMS packaging. Flexible cavity design, advances in\u0026nbsp;through-glass via technologies and dimensional stability of thin glass also\u0026nbsp;enable die stacking and 3D assembly for sensor-processor integration towards\u0026nbsp;sensor fusion. The following building block technologies were explored: (a) reliable cavity formation in thin glass panels (b) low stress glass-glass\u0026nbsp;bonding, and (c) high throughput, fully filled through-package-via\u0026nbsp;metallization in glass. Three main technical challenges were overcome to\u0026nbsp;realize the objectives: (a) glass cracking, side wall taper, side wall\u0026nbsp;roughness and defects, (b) interfacial voids at glass-polymer-glass interface\u0026nbsp;and (c) electrical opens and high frequency performance of copper paste\u0026nbsp;filled through-package-vias in glass.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Advances in Embedded Glass Packages for Low Stress and Near Hermetic Reliability"}],"uid":"28475","created_gmt":"2018-01-23 21:50:42","changed_gmt":"2018-01-24 16:31:03","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2018-01-29T10:30:00-05:00","event_time_end":"2018-01-29T12:30:00-05:00","event_time_end_last":"2018-01-29T12:30:00-05:00","gmt_time_start":"2018-01-29 15:30:00","gmt_time_end":"2018-01-29 17:30:00","gmt_time_end_last":"2018-01-29 17:30:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434391","name":"ECE M.S. Thesis Defenses"}],"categories":[],"keywords":[{"id":"147891","name":"ms thesis defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}