{"598553":{"#nid":"598553","#data":{"type":"news","title":"Bakir Appointed as Editor-in-Chief for IEEE CPMT Journal","body":[{"value":"\u003Cp\u003EMuhannad S. Bakir has been appointed as the editor-in-chief for the Electronics Manufacturing section of the \u003Cem\u003EIEEE Transactions on Components, Packaging, and Manufacturing Technology\u003C\/em\u003E (CPMT). This publication is the flagship journal for matters related to advanced packaging, 2.5D and 3D integrated circuit technologies, and heterogeneous integration. \u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EA professor in the Georgia Tech School of Electrical and Computer Engineering (ECE), Bakir is a past recipient of the IEEE CPMT Outstanding Young Engineer Award and is currently an IEEE CPMT Distinguished Lecturer. He leads the Integrated 3D Systems Group and is a member of the Georgia Tech Center for Co-design of Chip, Package, System (C3PS).\u003C\/p\u003E\r\n\r\n\u003Cp\u003EBakir has been on the ECE faculty since 2010, and prior to that time, he was a research engineer in the Microelectronics Research Center and the Nanotechnology Research Center from 2003-2010.\u0026nbsp;\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":[{"value":"\u003Cp\u003EECE Professor Muhannad S. Bakir has been appointed as the editor-in-chief for the Electronics Manufacturing section of the \u003Cem\u003EIEEE Transactions on Components, Packaging, and Manufacturing Technology\u003C\/em\u003E.\u003C\/p\u003E\r\n","format":"limited_html"}],"field_summary_sentence":[{"value":"ECE Professor Muhannad S. Bakir has been appointed as the editor-in-chief for the Electronics Manufacturing section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology. "}],"uid":"27241","created_gmt":"2017-11-08 19:09:10","changed_gmt":"2017-11-08 19:09:58","author":"Jackie Nemeth","boilerplate_text":"","field_publication":"","field_article_url":"","dateline":{"date":"2017-11-08T00:00:00-05:00","iso_date":"2017-11-08T00:00:00-05:00","tz":"America\/New_York"},"extras":[],"hg_media":{"379131":{"id":"379131","type":"image","title":"Muhannad Bakir","body":null,"created":"1449246214","gmt_created":"2015-12-04 16:23:34","changed":"1475894388","gmt_changed":"2016-10-08 02:39:48","alt":"Muhannad Bakir","file":{"fid":"75234","name":"muhannadbakir131018ar563_web.jpg","image_path":"\/sites\/default\/files\/images\/muhannadbakir131018ar563_web.jpg","image_full_path":"http:\/\/hg.gatech.edu\/\/sites\/default\/files\/images\/muhannadbakir131018ar563_web.jpg","mime":"image\/jpeg","size":5996233,"path_740":"http:\/\/hg.gatech.edu\/sites\/default\/files\/styles\/740xx_scale\/public\/images\/muhannadbakir131018ar563_web.jpg?itok=n-PcSzwe"}}},"media_ids":["379131"],"related_links":[{"url":"https:\/\/www.ece.gatech.edu\/faculty-staff-directory\/muhannad-s-bakir","title":"Muhannad S. Bakir"},{"url":"http:\/\/www.bakirlab.gatech.edu","title":"Integrated 3D Systems Lab"},{"url":"http:\/\/c3ps.gatech.edu\/center-co-design-chip-package-system","title":"Center for Co-design of Chip, Package, System"},{"url":"http:\/\/www.ece.gatech.edu","title":"School of Electrical and Computer Engineering"},{"url":"http:\/\/www.gatech.edu","title":"Georgia Tech"},{"url":"http:\/\/ieeexplore.ieee.org\/xpl\/RecentIssue.jsp?punumber=5503870","title":"IEEE Transactions on Components, Packaging, and Manufacturing Technology"}],"groups":[{"id":"1255","name":"School of Electrical and Computer Engineering"}],"categories":[{"id":"129","name":"Institute and Campus"},{"id":"130","name":"Alumni"},{"id":"134","name":"Student and Faculty"},{"id":"135","name":"Research"},{"id":"145","name":"Engineering"},{"id":"149","name":"Nanotechnology and Nanoscience"},{"id":"150","name":"Physics and Physical Sciences"}],"keywords":[{"id":"95831","name":"IEEE Transactions on Components"},{"id":"4187","name":"packaging"},{"id":"95841","name":"and Manufacturing Technology"},{"id":"63161","name":"integrated circuits"},{"id":"2784","name":"Nanotechnology Research Center"},{"id":"5519","name":"Microelectronics Research Center"},{"id":"109","name":"Georgia Tech"},{"id":"166855","name":"School of Electrical and Computer Engineering"},{"id":"99661","name":"Muhannad S. Bakir"},{"id":"176189","name":"Integrated 3D Systems Group; Center for Co-design of Chip"},{"id":"7410","name":"package"},{"id":"176190","name":"System;"}],"core_research_areas":[{"id":"39451","name":"Electronics and Nanotechnology"}],"news_room_topics":[],"event_categories":[],"invited_audience":[],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[{"value":"\u003Cp\u003EJackie Nemeth\u003C\/p\u003E\r\n\r\n\u003Cp\u003ESchool of Electrical and Computer Engineering\u003C\/p\u003E\r\n\r\n\u003Cp\u003E404-894-2906\u003C\/p\u003E\r\n","format":"limited_html"}],"email":["jackie.nemeth@ece.gatech.edu"],"slides":[],"orientation":[],"userdata":""}}}