Committee:

Dr. Rao Tummala, ECE, Chair , Advisor

Dr. Andrew Peterson, ECE

Dr. Manos Tentzeris, ECE

Dr. Raj Pulugurtha, PRC

Dr. Peter Hesketh, ME

Abstract:

The objective of this PhD dissertation is to design and demonstrate three-dimensional integrated passive device (3D IPD) diplexers and three-dimensional integrated passive and active component (3D IPAC) packages with ultra-miniaturized glass substrates for radio frequency (RF) fourth generation long-term evolution (4G LTE) front-end modules (FEMs). First, miniaturized low-loss high-rejection diplexers are designed and demonstrated on thin glass substrates as double-side embedded thinfilm passives, interconnected with through glass vias. Excellent manufacturing precision is achieved through comprehensive design sensitivity analysis and substrate process optimization. Second, 3D LTE modules are demonstrated on ultra-thin glass substrates with double-side integration of discrete components and substrate-embedded impedance matching networks. Design and process innovations on ultra-thin (50 -100 μm) glass substrates enable high-Q passives embedding, component-level electromagnetic interference (EMI) shielding and high package reliability. The proposed high-density 3D integration technology of RF passives and modules on advanced glass substrates, further extends the existing wireless communication systems towards high performance, multi-functionality and ultra-miniaturization.