Committee:

Dr. Muhannad Bakir, ECE, Chair , Advisor

Dr. Saibal Mukhopadhyay, ECE

Dr. Azad Naeemi, ECE

Dr. Arijit Raychowdhury, ECE

Dr. Yogendra Joshi, ME

Abstract:

The objective of this proposed research is to perform thermal and power delivery network (PDN) analysis and optimization for emerging integration systems such as three-dimensional and 2.5 dimensional integrated circuits. The key contribution of this research is in fourfold. First, a compact thermal model is developed and used for analyzing conventional 2-D, emerging 2.5-D and 3-D architectures. Second, a novel 3-D stacking structure with microfluidic cooling, thermal isolation using air gap and mechanically flexible interconnects, and an extended heat spreader is proposed, evaluated and demonstrated. Third, thermal studies are performed focusing on 2.5-D bridge-chip based platforms and benchmarked with other 2.5-D and 3-D integration solutions. Fourth, a PDN modeling framework is developed and used to benchmark different 2.5-D integration platforms focusing on bridge-chip based 2.5-D integration. Last, an integrated framework analyzing the power, thermal and power delivery network simultaneously is proposed. The integrated framework accurately model the above metrics and remove the pessimism of using worst-constraints in IC design.