Committee: 

Dr. Tummala, Advisor 

Dr. Peterson, Chair

Dr. Tentzeris

Dr. Hesketh

Dr. Pulugurtha

Abstract: The objective of the proposed research is to design and demonstrate three-dimensional integrated passive device (3D IPD) diplexers and three-dimensional integrated passive and active component (3D IPAC) packages with ultra-miniaturized glass substrates for radio frequency (RF) fourth generation long-term evolution (4G LTE) front-end modules (FEMs). First, high-rejection diplexers are integrated into low-loss thin glass substrates as double-side embedded thinfilm passives, interconnected with through glass vias. Second, 3D RF modules are demonstrated on ultra-thin glass substrates with double-side integration of discrete components and substrate-embedded impedance matching networks. Design and processes innovations on ultra-thin (50 -100 μm) glass substrates enable high-Q passives embedding, precise circuitry patterning and high package reliability. The proposed high-density 3D integration technology of RF passives and modules on advanced glass substrates, further extends the existing wireless communication systems towards high performance, multi-functionality and ultra-miniaturization.