{"588704":{"#nid":"588704","#data":{"type":"event","title":"Ph.D. Proposal Oral Exam - Zihan Wu","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle:\u0026nbsp; \u003C\/strong\u003E\u003Cem\u003EDesign and Demonstration of Ultra-miniaturized Glass-based 3D IPAC RF Front-end Modules for LTE Applications\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u0026nbsp; \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Tummala, Advisor\u0026nbsp;\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Peterson, Chair\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Tentzeris\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Hesketh\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Pulugurtha\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003EThe objective of the proposed research is to design and demonstrate three-dimensional integrated passive device (3D IPD) diplexers and three-dimensional integrated passive and active component (3D IPAC) packages with ultra-miniaturized glass substrates for radio frequency (RF) fourth generation long-term evolution (4G LTE) front-end modules (FEMs). First, high-rejection diplexers are integrated into low-loss thin glass substrates as double-side embedded thinfilm passives, interconnected with through glass vias. Second, 3D RF modules are demonstrated on ultra-thin glass substrates with double-side integration of discrete components and substrate-embedded impedance matching networks. Design and processes innovations on ultra-thin (50 -100 \u0026mu;m) glass substrates enable high-Q passives embedding, precise circuitry patterning and high package reliability. The proposed high-density 3D integration technology of RF passives and modules on advanced glass substrates, further extends the existing wireless communication systems towards high performance, multi-functionality and ultra-miniaturization.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Design and Demonstration of Ultra-miniaturized Glass-based 3D IPAC RF Front-end Modules for LTE Applications"}],"uid":"28475","created_gmt":"2017-03-13 23:22:40","changed_gmt":"2017-03-13 23:22:40","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2017-03-20T11:00:00-04:00","event_time_end":"2017-03-20T13:00:00-04:00","event_time_end_last":"2017-03-20T13:00:00-04:00","gmt_time_start":"2017-03-20 15:00:00","gmt_time_end":"2017-03-20 17:00:00","gmt_time_end_last":"2017-03-20 17:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434371","name":"ECE Ph.D. Proposal Oral Exams"}],"categories":[],"keywords":[{"id":"102851","name":"Phd proposal"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}