{"588549":{"#nid":"588549","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Hanju Oh","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle\u003C\/strong\u003E\u003Cem\u003E:\u0026nbsp; \u003C\/em\u003E\u003Cem\u003ESilicon Microsystem Platform with Integrated Microfluidic Cooling and Low-loss Through-silicon Vias\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Muhannad Bakir, ECE, Chair , Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Gary May, ECE, Co-Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Oliver Brand, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Hua Wang, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Madhavan Swaminathan, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Suresh Sitaraman, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract: \u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EMicrofluidic cooling technology is a promising thermal solution for high-performance three-dimensional (3-D) microsystems. However, the integration of microfluidic cooling into 3-D microsystems inevitably impacts tier-to-tier through-silicon vias (TSVs) by increasing their length and diameter (for a fixed aspect ratio). To address this challenge, we present the fabrication of high-aspect ratio (23:1) TSVs within a microfluidic pin-fin heat sink using two types of silicon etch masks. Moreover, the impact of liquid cooling on the electrical characteristics of TSVs is analyzed using a microfluidic cooling testbed containing TSVs. The high-frequency characterization of TSVs embedded in microfluidic pin-fins with the presence of deionized water is performed from 10 MHz to 20 GHz. Lastly, to electrically shield the signal transmission of such TSVs, coaxially-shielded TSVs consisting of a single signal TSV surrounded by multiple ground TSVs are demonstrated.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Silicon Microsystem Platform with Integrated Microfluidic Cooling and Low-loss Through-silicon Vias"}],"uid":"28475","created_gmt":"2017-03-09 22:05:05","changed_gmt":"2017-03-09 22:05:05","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2017-03-28T16:00:00-04:00","event_time_end":"2017-03-28T18:00:00-04:00","event_time_end_last":"2017-03-28T18:00:00-04:00","gmt_time_start":"2017-03-28 20:00:00","gmt_time_end":"2017-03-28 22:00:00","gmt_time_end_last":"2017-03-28 22:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}