Committee:

Dr. Rao Tummala, ECE, Chair , Advisor

Dr. Oliver Brand, ECE

Dr. Ajeet Rohatgi, ECE

Dr. Levent Degertekin, ECE

Dr. Raj Pulugurtha, PRC

Dr. Raghuram Pucha, ME

Abstract:

The escalating demand for higher bandwidth with high interconnection densities and ultra-short interconnectionsbetween components has been a key driver for package innovations. Innovative 3D interposers and packages are emerging as a promising solution to achieve such high bandwidth with low power and low cost. A key element of interposers is a thin substrate with ultra-small through-package-vias (TPVs) to vertically connect the components on one side of the interposer to the other side. Glass is emerging as a superior and low-cost material alternative to build interposers due to its high dimensional stability enabling high density I/O and high electrical resistivity leading to low electrical loss. Reliability of copper-plated through-package-vias in glass interposers forms the fundamental focus of this research.