{"583028":{"#nid":"583028","#data":{"type":"event","title":"Ph.D. Dissertation Defense - Kaya Demir","body":[{"value":"\u003Cp\u003E\u003Cstrong\u003ETitle\u003C\/strong\u003E\u003Cem\u003E:\u0026nbsp; \u003C\/em\u003E\u003Cem\u003EReliability Studies of Ultra-small Copper-plated Through-package-vias in Ultra-thin Glass Interposers\u003C\/em\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003ECommittee:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Rao Tummala, ECE, Chair , Advisor\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Oliver Brand, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Ajeet Rohatgi, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Levent Degertekin, ECE\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Raj Pulugurtha, PRC\u003C\/p\u003E\r\n\r\n\u003Cp\u003EDr. Raghuram Pucha, ME\u003C\/p\u003E\r\n\r\n\u003Cp\u003E\u003Cstrong\u003EAbstract:\u003C\/strong\u003E\u003C\/p\u003E\r\n\r\n\u003Cp\u003EThe\u0026nbsp;escalating demand for higher bandwidth with high interconnection densities and ultra-short interconnectionsbetween components has been a key driver for package innovations.\u0026nbsp;Innovative\u0026nbsp;3D interposers and packages are emerging as a promising solution\u0026nbsp;to achieve such\u0026nbsp;high\u0026nbsp;bandwidth\u0026nbsp;with low power and low cost. A key element of interposers\u0026nbsp;is a thin substrate with ultra-small through-package-vias (TPVs) to vertically connect the components on one side of the interposer to the other side. Glass is emerging as\u0026nbsp;a superior\u0026nbsp;and low-cost\u0026nbsp;material alternative to build\u0026nbsp;interposers due to its high dimensional stability enabling high density I\/O and high electrical resistivity leading to low electrical loss. Reliability of copper-plated through-package-vias in glass interposers forms the fundamental focus of this research.\u003C\/p\u003E\r\n","summary":null,"format":"limited_html"}],"field_subtitle":"","field_summary":"","field_summary_sentence":[{"value":"Reliability Studies of Ultra-small Copper-plated Through-package-vias in Ultra-thin Glass Interposers"}],"uid":"28475","created_gmt":"2016-10-24 22:20:02","changed_gmt":"2016-10-25 15:44:48","author":"Daniela Staiculescu","boilerplate_text":"","field_publication":"","field_article_url":"","field_event_time":{"event_time_start":"2016-10-31T12:00:00-04:00","event_time_end":"2016-10-31T14:00:00-04:00","event_time_end_last":"2016-10-31T14:00:00-04:00","gmt_time_start":"2016-10-31 16:00:00","gmt_time_end":"2016-10-31 18:00:00","gmt_time_end_last":"2016-10-31 18:00:00","rrule":null,"timezone":"America\/New_York"},"extras":[],"groups":[{"id":"434381","name":"ECE Ph.D. Dissertation Defenses"}],"categories":[],"keywords":[{"id":"100811","name":"Phd Defense"},{"id":"1808","name":"graduate students"}],"core_research_areas":[],"news_room_topics":[],"event_categories":[{"id":"1788","name":"Other\/Miscellaneous"}],"invited_audience":[{"id":"78771","name":"Public"}],"affiliations":[],"classification":[],"areas_of_expertise":[],"news_and_recent_appearances":[],"phone":[],"contact":[],"email":[],"slides":[],"orientation":[],"userdata":""}}}